loadpatents
name:-0.0070641040802002
name:-0.012646913528442
name:-0.00089192390441895
Kelkar; Nikhil V. Patent Filings

Kelkar; Nikhil V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kelkar; Nikhil V..The latest application filed is for "methods for manufacturing a radio frequency identification tag without aligning the chip and antenna".

Company Profile
0.10.3
  • Kelkar; Nikhil V. - San Jose CA
  • Kelkar, Nikhil V. - Santa Clara CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods For Manufacturing A Radio Frequency Identification Tag Without Aligning The Chip And Antenna
App 20140103120 - Kelkar; Nikhil V. ;   et al.
2014-04-17
Methods for manufacturing a radio frequency identification tag without aligning the chip and antenna
Grant 8,635,762 - Kelkar , et al. January 28, 2
2014-01-28
Solder bump formation in electronics packaging
Grant 7,674,702 - Patwardhan , et al. March 9, 2
2010-03-09
Reduced stress under bump metallization structure
Grant 7,420,280 - Kelkar September 2, 2
2008-09-02
Solder bump formation in electronics packaging
Grant 7,375,431 - Patwardhan , et al. May 20, 2
2008-05-20
Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same
Grant 7,230,580 - Kelkar , et al. June 12, 2
2007-06-12
Aluminum-free under bump metallization structure
Grant 7,095,116 - Kelkar , et al. August 22, 2
2006-08-22
Apparatus and method for a wafer level chip scale package heat sink
Grant 6,916,688 - Kelkar , et al. July 12, 2
2005-07-12
Apparatus and method for scribing semiconductor wafers using vision recognition
Grant 6,822,315 - Kelkar , et al. November 23, 2
2004-11-23
Apparatus and method for scribing semiconductor wafers using vision recognition
App 20030153179 - Kelkar, Nikhil V. ;   et al.
2003-08-14
Method of packaging fuses
App 20010015477 - Singh, Inderjit ;   et al.
2001-08-23
Chip-on-chip integrated circuit package and method for making the same
Grant 6,084,308 - Kelkar , et al. July 4, 2
2000-07-04

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