Kelkar; Nikhil

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kelkar; Nikhil.The latest application filed is for "circuit module such as a high-density lead frame array power module, and method of making same".

Company Profile

1.19.11

Kelkar; Nikhil - Saratoga CA
Kelkar; Nikhil - San Jose CA
Kelkar; Nikhil - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating a circuit module Grant 10,582,617 - Yin , et al.	2020-03-03
Circuit Module Such As A High-density Lead Frame Array Power Module, And Method Of Making Same App 20170325333 - YIN; Jian ; et al.	2017-11-09
Circuit module such as a high-density lead frame array (HDA) power module, and method of making same Grant 9,717,146 - Yin , et al. July 25, 2	2017-07-25
Circuit Module Such As A High-density Lead Frame Array (hda) Power Module, And Method Of Making Same App 20130314879 - YIN; Jian ; et al.	2013-11-28
Stacked power converter structure and method Grant 8,508,052 - Bell , et al. August 13, 2	2013-08-13
Optical sensors that reduce specular reflections Grant 8,324,602 - Wiese , et al. December 4, 2	2012-12-04
Optical sensors that reduce specular reflections Grant 8,232,541 - Wiese , et al. July 31, 2	2012-07-31
Tie-bar configuration for leadframe type carrier strips Grant 8,206,836 - Carpenter, Jr. , et al. June 26, 2	2012-06-26
High-efficiency Power Converters With Integrated Capacitors App 20120098090 - Hebert; Francois ; et al.	2012-04-26
Stacked Power Converter Structure And Method App 20110163434 - Bell; David B. ; et al.	2011-07-07
Stacked power converter structure and method Grant 7,923,300 - Bell , et al. April 12, 2	2011-04-12
Tie-Bar Configuration For Leadframe Type Carrier Strips App 20110033724 - Carpenter, JR.; Loyde M. ; et al.	2011-02-10
Low Thermal Resistance And Robust Chip-scale-package (csp), Structure And Method App 20100276701 - Hebert; Francois ; et al.	2010-11-04
Optical Sensors And Methods For Providing Optical Sensors App 20100259766 - Wiese; Lynn K. ; et al.	2010-10-14
Optical Sensors That Reduce Spectral Reflections App 20100258712 - Wiese; Lynn K. ; et al.	2010-10-14
Optical Sensors That Reduce Spectral Reflections App 20100258710 - Wiese; Lynn K. ; et al.	2010-10-14
Method to dispense light blocking material for wafer level CSP Grant 7,510,908 - Nguyen , et al. March 31, 2	2009-03-31
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages Grant 7,413,927 - Patwardhan , et al. August 19, 2	2008-08-19
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages Grant 7,301,222 - Patwardhan , et al. November 27, 2	2007-11-27
Method and apparatus for forming an underfill adhesive layer Grant 7,253,078 - Nguyen , et al. August 7, 2	2007-08-07
Post singulation die separation apparatus and method for bulk feeding operation Grant 7,045,035 - Kelkar , et al. May 16, 2	2006-05-16
Post singulation die separation apparatus and method for bulk feeding operation Grant 6,932,136 - Kelkar , et al. August 23, 2	2005-08-23
Integrated circuit packages with interconnects on top and bottom surfaces Grant 6,803,648 - Kelkar , et al. October 12, 2	2004-10-12
Process and structure improvements to shellcase style packaging technology Grant 6,607,941 - Prabhu , et al. August 19, 2	2003-08-19
Process And Structure Improvements To Shellcase Style Packaging Technology App 20030134453 - Prabhu, Ashok ; et al.	2003-07-17
Front side coating for bump devices Grant 6,468,892 - Baker , et al. October 22, 2	2002-10-22
Method and apparatus for forming a plastic chip on chip package module Grant 6,238,949 - Nguyen , et al. May 29, 2	2001-05-29

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