Keleher; Jason

Patent Applications and Registrations

Patent applications and USPTO patent grants for Keleher; Jason.The latest application filed is for "dilutable cmp composition containing a surfactant".

Company Profile

0.8.10

Keleher; Jason - Joliet IL US
Keleher; Jason - Aurora IL
Keleher; Jason - Potsdam NY
Keleher, Jason - Schenectady NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal-passivating CMP compositions and methods Grant 8,435,421 - Keleher , et al. May 7, 2	2013-05-07
Dilutable Cmp Composition Containing A Surfactant App 20110247996 - De Rege Thesauro; Francesco ; et al.	2011-10-13
Copper-passivating CMP compositions and methods Grant 7,955,520 - White , et al. June 7, 2	2011-06-07
Metal-passivating Cmp Compositions And Methods App 20110100956 - KELEHER; Jason ; et al.	2011-05-05
Copper-passivating CMP compositions and methods App 20090134122 - White; Daniela ; et al.	2009-05-28
Compositions and methods for CMP of low-k-dielectric materials Grant 7,456,107 - Keleher , et al. November 25, 2	2008-11-25
Dilutable Cmp Composition Containing A Surfactant App 20080203059 - De Rege Thesauro; Francesco ; et al.	2008-08-28
Compositions and methods for CMP of low-k-dielectric materials App 20080111101 - Keleher; Jason ; et al.	2008-05-15
Chemically Modified Chemical Mechanical Polishing Pad App 20080034670 - Li; Yuzhuo ; et al.	2008-02-14
Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing App 20070037491 - Li; Yuzhuo ; et al.	2007-02-15
Photo-chemical remediation of Cu-CMP waste Grant 6,916,428 - Li , et al. July 12, 2	2005-07-12
Photo-chemical remediation of Cu-CMP waste App 20050072742 - Li, Yuzhuo ; et al.	2005-04-07
Chemical mechanical polishing composition and method App 20040092102 - Li, Yuzhou ; et al.	2004-05-13
Method of fabricating a copper damascene structure Grant 6,660,639 - Li , et al. December 9, 2	2003-12-09
Silica-based slurry Grant 6,656,241 - Hellring , et al. December 2, 2	2003-12-02
Method of fabricating a copper damascene structure App 20030098434 - Li, Yuzhuo ; et al.	2003-05-29
Slurry for chemical-mechanical polishing copper damascene structures Grant 6,508,953 - Li , et al. January 21, 2	2003-01-21

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