| Patent | Date |
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Group Iii-v Semiconductor Structures Having Crystalline Regrowth Layers And Methods For Forming Such Structures
App 20220140126 - LaRoche; Jeffrey R. ; et al. | 2022-05-05 |
Electrode structure for field effect transistor
Grant 11,239,326 - LaRoche , et al. February 1, 2 | 2022-02-01 |
Nitride structures having low capacitance gate contacts integrated with copper damascene structures
Grant 11,177,216 - LaRoche , et al. November 16, 2 | 2021-11-16 |
Low-Temperature Deposition of High-Quality Aluminum Nitride Films for Heat Spreading Applications
App 20210249331 - Ueda; Scott ; et al. | 2021-08-12 |
Wafer structure with mode suppression
Grant 10,930,742 - Kazemi , et al. February 23, 2 | 2021-02-23 |
Wafer Structure With Mode Suppression
App 20200219982 - Kazemi; Hooman ; et al. | 2020-07-09 |
Nitride Structures Having Low Capacitance Gate Contacts Integrated With Copper Damascene Structures
App 20200083167 - LaRoche; Jeffrey R. ; et al. | 2020-03-12 |
Electrode Structure For Field Effect Transistor
App 20190237554 - LaRoche; Jeffrey R. ; et al. | 2019-08-01 |
Reconstituted Wafer Structure
App 20190165108 - Kazemi; Hooman ; et al. | 2019-05-30 |
Electrode Structure For Field Effect Transistor
App 20190097001 - LaRoche; Jeffrey R. ; et al. | 2019-03-28 |
Nitride structure having gold-free contact and methods for forming such structures
Grant 10,224,285 - LaRoche , et al. | 2019-03-05 |
Nitride structure having gold-free contact and methods for forming such structures
Grant 10,096,550 - LaRoche , et al. October 9, 2 | 2018-10-09 |
Nitride Structure Having Gold-free Contact And Methods For Forming Such Structures
App 20180240753 - LaRoche; Jeffrey R. ; et al. | 2018-08-23 |
Nitride Structure Having Gold-free Contact And Methods For Forming Such Structures
App 20180240754 - LaRoche; Jeffrey R. ; et al. | 2018-08-23 |
Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers
Grant 9,761,445 - LaRoche , et al. September 12, 2 | 2017-09-12 |
Microwave integrated circuit (MMIC) damascene electrical interconnect for microwave energy transmission
Grant 9,478,508 - LaRoche , et al. October 25, 2 | 2016-10-25 |
Methods And Structures For Forming Microstrip Transmission Lines On Thin Silicon Carbide On Insulator (sicoi) Wafers
App 20160211136 - LaRoche; Jeffrey R. ; et al. | 2016-07-21 |
Double heterojunction group III-nitride structures
Grant 9,231,064 - Reza , et al. January 5, 2 | 2016-01-05 |
Method For Reducing Growth Of Non-uniformities And Autodoping During Column Iii-v Growth Into Dielectric Windows
App 20150059640 - LaRoche; Jeffrey R. ; et al. | 2015-03-05 |
Method and structure having monolithic heterogeneous integration of compound semiconductors with elemental semiconductor
Grant 8,575,666 - LaRoche , et al. November 5, 2 | 2013-11-05 |
Passivation layer for a circuit device and method of manufacture
Grant RE44,303 - Bedinger , et al. June 18, 2 | 2013-06-18 |
Gold-free ohmic contacts
Grant 8,466,555 - Chelakara , et al. June 18, 2 | 2013-06-18 |
Method And Structure Having Monolithic Heterogeneous Integration Of Compound Semiconductors With Elemental Semiconductor
App 20130082281 - LaRoche; Jeffrey R. ; et al. | 2013-04-04 |
Gold-free Ohmic Contacts
App 20120305931 - Chelakara; Ram V. ; et al. | 2012-12-06 |
Passivation layer for a circuit device and method of manufacture
Grant 7,902,083 - Bedinger , et al. March 8, 2 | 2011-03-08 |
Passivation layer for a circuit device and method of manufacture
Grant 7,767,589 - Bedinger , et al. August 3, 2 | 2010-08-03 |
Passivation Layer for a Circuit Device and Method of Manufacture
App 20100120254 - Bedinger; John M. ; et al. | 2010-05-13 |
Method For Packaging Semiconductors At A Wafer Level
App 20080308922 - Zhang; Yiwen ; et al. | 2008-12-18 |
Passivation Layer for a Circuit Device and Method of Manufacture
App 20080185174 - Bedinger; John M. ; et al. | 2008-08-07 |
MMIC having back-side multi-layer signal routing
Grant 7,387,958 - McCarroll , et al. June 17, 2 | 2008-06-17 |
MMIC having back-side multi-layer signal routing
App 20070020915 - McCarroll; Christopher P. ; et al. | 2007-01-25 |
Direct backside interconnect for multiple chip assemblies
Grant 6,175,287 - Lampen , et al. January 16, 2 | 2001-01-16 |
Semiconductor structures having dual surface via holes
Grant 5,343,071 - Kazior , et al. August 30, 1 | 1994-08-30 |
Selective backside plating of GaAs monolithic microwave integrated circuits
Grant 4,970,578 - Tong , et al. November 13, 1 | 1990-11-13 |
Simultaneous formation of via hole and tube structures for GaAs monolithic microwave integrated circuits
Grant 4,927,784 - Kazior , et al. May 22, 1 | 1990-05-22 |
Simultaneous formation of via hole and tub structures for GaAs monolithic microwave integrated circuits
Grant 4,807,022 - Kazior , et al. February 21, 1 | 1989-02-21 |
Selective backside plating of gaas monolithic microwave integrated circuits
Grant 4,794,093 - Tong , et al. December 27, 1 | 1988-12-27 |
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