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name:-0.0081439018249512
name:-0.004443883895874
name:-0.0005040168762207
Kayano; Hisashi Patent Filings

Kayano; Hisashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kayano; Hisashi.The latest application filed is for "thermosetting resin injection molding method capable of reducing molding time".

Company Profile
0.5.6
  • Kayano; Hisashi - Toyoake JP
  • Kayano, Hisashi - Toyoake-city JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Die forming method for forming female screw
Grant 7,007,736 - Suzuki , et al. March 7, 2
2006-03-07
Thermosetting resin injection molding method capable of reducing molding time
App 20050248048 - Suzuki, Makoto ;   et al.
2005-11-10
Vehicle-mounted structure for heat exchanger
Grant 6,827,129 - Ozawa , et al. December 7, 2
2004-12-07
Die forming method for forming female screw
App 20040159417 - Suzuki, Hideyuki ;   et al.
2004-08-19
Method for joining resinous products by effectively heating joining surfaces
App 20030111765 - Ichikawa, Masato ;   et al.
2003-06-19
Method of fabricating metal composite compact
Grant 6,488,887 - Arai , et al. December 3, 2
2002-12-03
Insert-molding method and and device therefor
App 20020135101 - Onoue, Tsutomu ;   et al.
2002-09-26
Insert-molding method for obtaining a resin-molded product
Grant 6,428,732 - Onoue , et al. August 6, 2
2002-08-06
Vehicle-mounted structure for heat exchanger
App 20010050160 - Ozawa, Ikuo ;   et al.
2001-12-13
Resin molding for vehicle use and manufacturing method thereof
App 20010027883 - Sasano, Norihisa ;   et al.
2001-10-11
Rotational phase adjusting apparatus resin seal
Grant 5,875,750 - Iwasaki , et al. March 2, 1
1999-03-02

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