Kayamori; Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kayamori; Jun.The latest application filed is for "semiconductor device including semiconductor chips with different thickness".
- Kayamori; Jun - Tokyo JP
- Kayamori; Jun - Chuo-ku JP
| Patent | Date |
|---|---|
| Semiconductor device including semiconductor chips with different thickness Grant 8,372,693 - Katagiri , et al. February 12, 2 | 2013-02-12 |
| Semiconductor Device Including Semiconductor Chips With Different Thickness App 20120302007 - KATAGIRI; Mitsuaki ; et al. | 2012-11-29 |
| Semiconductor device including semiconductor chips with different thickness Grant 8,237,251 - Katagiri , et al. August 7, 2 | 2012-08-07 |
| Semiconductor Device Including Semiconductor Chips With Different Thickness App 20090184409 - KATAGIRI; Mitsuaki ; et al. | 2009-07-23 |
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