Kayaba; Yasuhisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kayaba; Yasuhisa.The latest application filed is for "method of manufacturing substrate layered body and layered body".

Company Profile

10.10.17

Kayaba; Yasuhisa - Urayasu JP
KAYABA; Yasuhisa - Urayasu-shi Chiba
Kayaba; Yasuhisa - Sodegaura JP
KAYABA; Yasuhisa - Sodegaura-shi Chiba

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device Grant 11,209,735 - Kayaba , et al. December 28, 2	2021-12-28
Method Of Manufacturing Substrate Layered Body And Layered Body App 20210391292 - KAYABA; Yasuhisa ; et al.	2021-12-16
Semiconductor Element Intermediate, And Method Of Producing Semiconductor Element Intermediate App 20210375710 - WACHI; Hiroko ; et al.	2021-12-02
Semiconductor Element Intermediate, Composition For Forming Metal-containing Film, Method Of Producing Semiconductor Element Intermediate, And Method Of Producing Semiconductor Element App 20210191269 - WACHI; Hiroko ; et al.	2021-06-24
Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same Grant 10,988,647 - Kamada , et al. April 27, 2	2021-04-27
Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method Grant 10,950,532 - Kayaba , et al. March 16, 2	2021-03-16
Semiconductor Substrate Manufacturing Method, Semiconductor Device, And Method For Manufacturing Same App 20200377772 - KAMADA; Jun ; et al.	2020-12-03
Semiconductor Film Composition, Method For Manufacturing Semiconductor Film Composition, Method For Manufacturing Semiconductor Member, Method For Manufacturing Semiconductor Processing Material, And Semiconductor Device App 20200347265 - KAYABA; Yasuhisa ; et al.	2020-11-05
Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device Grant 10,759,964 - Kayaba , et al. Sep	2020-09-01
Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device Grant 10,752,805 - Kayaba , et al. A	2020-08-25
Method For Producing Semiconductor Device And Intermediate For Semiconductor Device App 20200168476 - KAMADA; Jun ; et al.	2020-05-28
Method Of Producing Substrate With Fine Uneven Pattern, Resin Composition, And Laminate App 20200166835 - ODA; Takashi ; et al.	2020-05-28
Sealing composition and method of manufacturing semiconductor device Grant 10,580,639 - Kayaba , et al.	2020-03-03
Substrate Laminated Body And Method Of Manufacturing Substrate Laminated Body App 20200048515 - KAMADA; Jun ; et al.	2020-02-13
Composition For Forming Metal-containing Film, Method Of Producing Composition For Forming Metal-containing Film, Semiconductor App 20190187560 - KAYABA; Yasuhisa ; et al.	2019-06-20
Semiconductor Film Composition, Method For Manufacturing Semiconductor Film Composition, Method For Manufacturing Semiconductor Member, Method For Manufacturing Semiconductor Processing Material, And Semiconductor Device App 20180334588 - KAYABA; Yasuhisa ; et al.	2018-11-22
Semiconductor Film Composition, Method Of Manufacturing Semiconductor Film Composition, Method Of Manufacturing Semiconductor Member, Method Of Manufacturing Semiconductor Processing Material, And Semiconductor Device App 20180327547 - KAYABA; Yasuhisa ; et al.	2018-11-15
Method for manufacturing filling planarization film and method for manufacturing electronic device Grant 10,043,677 - Tanaka , et al. August 7, 2	2018-08-07
Method for manufacturing composite body and composition Grant 10,020,238 - Kayaba , et al. July 10, 2	2018-07-10
Method For Manufacturing Filling Planarization Film And Method For Manufacturing Electronic Device App 20180076047 - TANAKA; Hirofumi ; et al.	2018-03-15
Substrate Intermediary Body, Through-hole Via Electrode Substrate, And Through-hole Via Electrode Formation Method App 20170372993 - KAYABA; Yasuhisa ; et al.	2017-12-28
Semiconductor device, method for manufacturing the same, and rinsing liquid Grant 9,780,008 - Ono , et al. October 3, 2	2017-10-03
Sealing Composition And Method Of Manufacturing Semiconductor Device App 20170162382 - KAYABA; Yasuhisa ; et al.	2017-06-08
Method For Manufacturing Composite Body And Composition App 20160049343 - KAYABA; Yasuhisa ; et al.	2016-02-18
Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same Grant 9,169,353 - Ono , et al. October 27, 2	2015-10-27
Semiconductor Device, Method For Manufacturing The Same, And Rinsing Liquid App 20150187670 - Ono; Shoko ; et al.	2015-07-02
Sealing Composition For Semiconductor, Semiconductor Device And Method Of Producing The Same, And Polymer And Method Of Producing The Same App 20140367868 - Ono; Shoko ; et al.	2014-12-18

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