KAWAZU; Yoshiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAWAZU; Yoshiki.The latest application filed is for "high-frequency board, high-frequency package, and high-frequency module".

Company Profile

0.9.11

KAWAZU; Yoshiki - Higashiomi-shi JP
Kawazu; Yoshiki - Higashiomi JP
KAWAZU; Yoshiki - Higashiomi-city Shiga-ken
Kawazu; Yoshiki - Kyoto JP
KAWAZU; Yoshiki - Kyoto-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High-frequency Board, High-frequency Package, And High-frequency Module App 20210368616 - KAWAZU; Yoshiki	2021-11-25
High-frequency board, high-frequency package, and high-frequency module Grant 11,102,880 - Kawazu August 24, 2	2021-08-24
High-frequency board, high-frequency package, and high-frequency module Grant 10,869,387 - Kawazu December 15, 2	2020-12-15
High-frequency Board, High-frequency Package, And High-frequency Module App 20200337150 - KAWAZU; Yoshiki	2020-10-22
High-frequency Board, High-frequency Package, And High-frequency Module App 20190246495 - KAWAZU; Yoshiki	2019-08-08
Semiconductor element package, semiconductor device, and mounting structure Grant 10,068,818 - Kawazu September 4, 2	2018-09-04
Circuit board, electronic component housing package, and electronic device Grant 10,051,725 - Kawazu August 14, 2	2018-08-14
Electronic component containing package and electronic device Grant 10,014,233 - Kawazu July 3, 2	2018-07-03
Semiconductor Element Package, Semiconductor Device, And Mounting Structure App 20180130718 - KAWAZU; Yoshiki	2018-05-10
Electronic component housing package and electronic device Grant 9,935,025 - Kawazu April 3, 2	2018-04-03
Electronic component housing package, and electronic device comprising same Grant 9,922,925 - Kawazu March 20, 2	2018-03-20
Electronic Component Containing Package And Electronic Device App 20170323836 - KAWAZU; Yoshiki	2017-11-09
Element-accommodating package and mounting structure Grant 9,805,995 - Kawazu October 31, 2	2017-10-31
Electronic Component Housing Package, And Electronic Device Comprising Same App 20170133315 - KAWAZU; Yoshiki	2017-05-11
Electronic Component Housing Package And Electronic Device App 20170069556 - KAWAZU; Yoshiki	2017-03-09
Element-accommodating Package And Mounting Structure App 20160343628 - KAWAZU; Yoshiki	2016-11-24
Element housing package and mounting structure body Grant 9,462,709 - Kawazu October 4, 2	2016-10-04
Circuit Board, Electronic Component Housing Package, And Electronic Device App 20160120026 - KAWAZU; Yoshiki	2016-04-28
Element Housing Package And Mounting Structure Body App 20150173214 - Kawazu; Yoshiki	2015-06-18
Electronic Component Housing Package And Electronic Apparatus App 20140345929 - Tsujino; Mahiro ; et al.	2014-11-27

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