Kawata; Tatsuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawata; Tatsuo.The latest application filed is for "resin-sealed semiconductor device, and die bonding material and sealing material for use therein".
- Kawata; Tatsuo - Yuki JP
- Kawata, Tatsuo - Ibaraki-ken JP
- Kawata; Tatsuo - Shimodate JP
| Patent | Date |
|---|---|
| Resin-sealed semiconductor device, and die bonding material and sealing material for use therein Grant 6,774,501 - Kurafuchi , et al. August 10, 2 | 2004-08-10 |
| Resin-sealed semiconductor device, and die bonding material and sealing material for use therein App 20040000728 - Kurafuchi, Kazuhiko ; et al. | 2004-01-01 |
| Encapsulant composition and electronic device Grant 6,284,818 - Kawata , et al. September 4, 2 | 2001-09-04 |
| Encapsulating material and LOC structure semiconductor device using the same Grant 6,211,277 - Kawata , et al. April 3, 2 | 2001-04-03 |
| Resin encapsulated semiconductor device Grant 4,965,657 - Ogata , et al. October 23, 1 | 1990-10-23 |
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