Kawasumi; Masao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawasumi; Masao.The latest application filed is for "resin paste for die bonding and its use".
- Kawasumi; Masao - Hitachi-shi JP
- Kawasumi; Masao - Hitachi JP
- Kawasumi, Masao - Ibaraki-ken JP
| Patent | Date |
|---|---|
| Resin Paste For Die Bonding And Its Use App 20070290369 - Hasegawa; Yuji ; et al. | 2007-12-20 |
| Resin-sealed semiconductor device, and die bonding material and sealing material for use therein Grant 6,774,501 - Kurafuchi , et al. August 10, 2 | 2004-08-10 |
| Resin-sealed semiconductor device, and die bonding material and sealing material for use therein App 20040000728 - Kurafuchi, Kazuhiko ; et al. | 2004-01-01 |
| Epoxy resin and adhesive composition containing the same Grant 5,350,811 - Ichimura , et al. September 27, 1 | 1994-09-27 |
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