Kawashima; Saburo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawashima; Saburo.The latest application filed is for "heat-resistant adhesive and method of adhesion by using adhesive".

Company Profile

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Kawashima; Saburo - Kanagawa JP
Kawashima; Saburo - Yokosuka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat-resistant adhesive and method of adhesion by using adhesive Grant 5,252,700 - Okikawa , et al. October 12, 1	1993-10-12
Polyimide/polyamideimide resin composition Grant 4,987,197 - Ohta , et al. January 22, 1	1991-01-22
Polyimide and high-temperature adhesive thereof Grant 4,931,531 - Tamai , et al. June 5, 1	1990-06-05
Polyimide Grant 4,908,409 - Oikawa , et al. March 13, 1	1990-03-13
Flexible copper-clad circuit substrate Grant 4,883,718 - Ohta , et al. November 28, 1	1989-11-28
High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine Grant 4,797,466 - Oikawa , et al. January 10, 1	1989-01-10
High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane Grant 4,795,798 - Tamai , et al. January 3, 1	1989-01-03
Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide Grant 4,734,482 - Tamai , et al. March 29, 1	1988-03-29
Color-developer for pressure-sensitive recording sheets Grant 4,400,492 - Asano , et al. August 23, 1	1983-08-23

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