loadpatents
name:-0.043771028518677
name:-0.026792049407959
name:-0.0084719657897949
Kawase; Yasuhiro Patent Filings

Kawase; Yasuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawase; Yasuhiro.The latest application filed is for "chatbot control device and chatbot control method".

Company Profile
6.26.36
  • Kawase; Yasuhiro - Nisshin JP
  • Kawase; Yasuhiro - Tokyo JP
  • Kawase; Yasuhiro - Nishio JP
  • KAWASE; Yasuhiro - Nisshin-city JP
  • Kawase; Yasuhiro - Kitakyushu JP
  • KAWASE; Yasuhiro - Nishio-city JP
  • KAWASE; Yasuhiro - Kitakyushu-shi JP
  • Kawase; Yasuhiro - Miyagi JP
  • Kawase; Yasuhiro - Nishio-shi JP
  • Kawase; Yasuhiro - Fukuoka N/A JP
  • Kawase; Yasuhiro - Minato-ku JP
  • Kawase; Yasuhiro - Sendai JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat pump cycle device and valve device
Grant 11,391,499 - Kato , et al. July 19, 2
2022-07-19
Chatbot Control Device And Chatbot Control Method
App 20220222360 - Kawase; Yasuhiro ;   et al.
2022-07-14
Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method of Preparing Semiconductor Wafer
App 20220028681 - Shibata; Toshiaki ;   et al.
2022-01-27
Integrated valve device
Grant 11,225,125 - Ito , et al. January 18, 2
2022-01-18
Chat system and chat management apparatus
Grant 11,115,446 - Kawase , et al. September 7, 2
2021-09-07
Cleaning agent composition for semiconductor device substrate, method of cleaning semiconductor device substrate, method of manufacturing semiconductor device substrate, and semiconductor device substrate
Grant 11,066,627 - Kusano , et al. July 20, 2
2021-07-20
Cleaning Liquid, Cleaning Method, And Method For Producing Semiconductor Wafer
App 20210171878 - SHIBATA; Toshiaki ;   et al.
2021-06-10
Chat System And Chat Management Apparatus
App 20210160292 - KAWASE; Yasuhiro ;   et al.
2021-05-27
Electric flow control valve and actuator
Grant 10,731,770 - Kawase , et al.
2020-08-04
Apparatus And Method
App 20200186371 - Shioya; Tomohiro ;   et al.
2020-06-11
Heat Pump Cycle Device And Valve Device
App 20200158382 - KATO; Daiki ;   et al.
2020-05-21
Integrated Valve Device
App 20200156444 - ITO; Tetsuya ;   et al.
2020-05-21
Cleaning Agent Composition For Semiconductor Device Substrate, Method Of Cleaning Semiconductor Device Substrate, Method Of Manu
App 20200002652 - KUSANO; Tomohiro ;   et al.
2020-01-02
Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition
Grant 10,400,151 - Yamazaki , et al. Sep
2019-09-03
Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device
Grant 10,125,289 - Sugiyama , et al. November 13, 2
2018-11-13
Electric Flow Control Valve And Actuator
App 20180202569 - KAWASE; Yasuhiro ;   et al.
2018-07-19
Interlayer filler composition for three-dimensional integrated circuit
Grant 9,960,092 - Ikemoto , et al. May 1, 2
2018-05-01
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
Grant 9,847,298 - Kawase , et al. December 19, 2
2017-12-19
Agglomerated Boron Nitride Particles, Composition Containing Said Particles, And Three-dimensional Integrated Circuit Having Layer Comprising Said Composition
App 20170335160 - YAMAZAKI; Masanori ;   et al.
2017-11-23
Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
Grant 9,822,294 - Yamazaki , et al. November 21, 2
2017-11-21
Interlayer Filler Composition For Semiconductor Device And Method For Producing Semiconductor Device
App 20170287866 - IKEMOTO; Makoto ;   et al.
2017-10-05
Data Processing System, Data Embedding Device And Data Embedding Program
App 20170220529 - SHIMAZAWA; Ko ;   et al.
2017-08-03
Three-dimensional Integrated Circuit Laminate, And Interlayer Filler For Three-dimensional Integrated Circuit Laminate
App 20170033050 - KAWASE; Yasuhiro ;   et al.
2017-02-02
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
Grant 9,508,648 - Kawase , et al. November 29, 2
2016-11-29
Metal oxide film, laminate, metal member and process for producing the same
Grant 9,476,137 - Ohmi , et al. October 25, 2
2016-10-25
Rotary pump and braking system having the same
Grant 9,358,967 - Uchiyama , et al. June 7, 2
2016-06-07
Composition For Interlayer Filler Of Layered Semiconductor Device, Layered Semiconductor Device, And Process For Producing Layered Semiconductor Device
App 20160009947 - SUGIYAMA; Masaya ;   et al.
2016-01-14
Rotating pump and brake system using same
Grant 9,163,627 - Kawase , et al. October 20, 2
2015-10-20
Agglomerated Boron Nitride Particles, Composition Containing Said Particles, And Three-dimensional Integrated Circuit Having Layer Comprising Said Composition
App 20140349105 - YAMAZAKI; Masanori ;   et al.
2014-11-27
Rotary Pump And Brake Device Having The Same
App 20140178236 - Uchiyama; Kazunori ;   et al.
2014-06-26
Rotating Pump And Brake System Using Same
App 20140152084 - Kawase; Yasuhiro ;   et al.
2014-06-05
Rotary Pump And Braking System Having The Same
App 20140117748 - Uchiyama; Kazunori ;   et al.
2014-05-01
Structural member to be used in apparatus for manufacturing semiconductor or flat display, and method for producing the same
Grant 8,642,187 - Ohmi , et al. February 4, 2
2014-02-04
Three-dimensional Integrated Circuit Laminate, And Interlayer Filler For Three-dimensional Integrated Circuit Laminate
App 20140027885 - KAWASE; Yasuhiro ;   et al.
2014-01-30
Interlayer Filler Composition For Three-dimensional Integrated Circuit, Coating Fluid And Process For Producing Three-dimensional Integrated Circuit
App 20140030848 - IKEMOTO; Makoto ;   et al.
2014-01-30
Vehicle Cooling System
App 20130319038 - Kawase; Yasuhiro ;   et al.
2013-12-05
Metal member having a metal oxide film and method of manufacturing the same
Grant 8,282,807 - Ohmi , et al. October 9, 2
2012-10-09
Metal Oxide Film, Laminate, Metal Member And Process For Producing The Same
App 20120247961 - Ohmi; Tadahiro ;   et al.
2012-10-04
Polishing Slurry For Silicon Carbide And Polishing Method Therefor
App 20120240479 - Doi; Toshiro ;   et al.
2012-09-27
Metal oxide film, laminate, metal member and process for producing the same
Grant 8,206,833 - Ohmi , et al. June 26, 2
2012-06-26
Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structure
Grant 8,124,240 - Ohmi , et al. February 28, 2
2012-02-28
Cleaning solution for substrate for semiconductor device and process for producing substrate for semiconductor device
Grant 8,110,534 - Kawase , et al. February 7, 2
2012-02-07
Method of forming oxide film by anodically oxidizing in an electrolyte solution
Grant 7,906,004 - Mizutani , et al. March 15, 2
2011-03-15
Fluid machine for rankine cycle
Grant 7,870,733 - Uno , et al. January 18, 2
2011-01-18
Structural Member To Be Used In Apparatus For Manufacturing Semiconductor Or Flat Display, And Method For Producing The Same
App 20100330390 - Ohmi; Tadahiro ;   et al.
2010-12-30
Air conditioner for vehicle
App 20100281901 - Kawase; Yasuhiro ;   et al.
2010-11-11
Cleaning Solution For Substrate For Semiconductor Device And Process For Producing Substrate For Semiconductor Device
App 20100167972 - Kawase; Yasuhiro ;   et al.
2010-07-01
Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
Grant 7,621,281 - Ikemoto , et al. November 24, 2
2009-11-24
Protective Film Structure of Metal Member, Metal Component Employing Protective Film Structure, and Equipment for Producing Semiconductor or Flat-Plate Display Employing Protective Film Structure
App 20090142588 - Ohmi; Tadahiro ;   et al.
2009-06-04
Gold Plating Liquid And Gold Plating Method
App 20090038957 - Sakakihara; Toshiaki ;   et al.
2009-02-12
Metal Oxide Film, Laminate, Metal Member And Process For Producing The Same
App 20090038946 - Ohmi; Tadahiro ;   et al.
2009-02-12
Electrolyte Solution And Method Of Forming Oxide Film Using The Same, Stack And Process Of Producing The Same, And Metal Oxide Film
App 20090023001 - Mizutani; Fumikazu ;   et al.
2009-01-22
Gold plating solution and gold plating method
Grant 7,407,569 - Mizutani , et al. August 5, 2
2008-08-05
Metal Member Having A Metal Oxide Film And Method Of Manufacturing The Same
App 20080164151 - Ohmi; Tadahiro ;   et al.
2008-07-10
Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
App 20080011321 - Ikemoto; Makoto ;   et al.
2008-01-17
Fluid machine for Rankine cycle
App 20070175212 - Uno; Keiichi ;   et al.
2007-08-02
Gold plating solution and gold plating method
App 20050056545 - Mizutani, Fumikazu ;   et al.
2005-03-17
Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
App 20050020463 - Ikemoto, Makoto ;   et al.
2005-01-27
Photoresist composition
Grant 5,759,736 - Nishi , et al. June 2, 1
1998-06-02

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