Kawano; Shigeki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawano; Shigeki.The latest application filed is for "wet etched insulator and electronic circuit component".

Company Profile

0.11.13

Kawano; Shigeki - Tokyo-To JP
Kawano; Shigeki - Shinjuku-ku JP
Kawano; Shigeki - Tokyo JP
Kawano; Shigeki - Yokosuka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wet etched insulator and electronic circuit component Grant 8,308,967 - Sakayori , et al. November 13, 2	2012-11-13
Laminate and use thereof Grant 8,252,423 - Sakayori , et al. August 28, 2	2012-08-28
Suspension substrate, suspension, head suspension and hard disk drive Grant 8,208,226 - Kawano June 26, 2	2012-06-26
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film Grant 8,066,891 - Sakayori , et al. November 29, 2	2011-11-29
Wet Etched Insulator And Electronic Circuit Component App 20110108519 - SAKAYORI; Katsuya ; et al.	2011-05-12
Laminate And Use Thereof App 20110076855 - SAKAYORI; Katsuya ; et al.	2011-03-31
Suspension Substrate, Suspension, Head Suspension And Hard Disk Drive App 20100142097 - KAWANO; Shigeki	2010-06-10
Wet etched insulator and electronic circuit component Grant 7,226,806 - Sakayori , et al. June 5, 2	2007-06-05
Wet etched insulator and electronic circuit component App 20070120229 - Sakayori; Katsuya ; et al.	2007-05-31
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film App 20070026678 - Sakayori; Katsuya ; et al.	2007-02-01
HDD suspension and its manufacture App 20060073316 - Okamura; Kazuto ; et al.	2006-04-06
Method of manufacturing wireless suspension blank Grant 6,942,817 - Yagi , et al. September 13, 2	2005-09-13
Method of manufacturing wireless suspension blank Grant 6,750,148 - Sakayori , et al. June 15, 2	2004-06-15
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film App 20040096676 - Sakayori, Katsuya ; et al.	2004-05-20
Production process of electronic component using wet etching, electronic component, and suspension for hard disk Grant 6,709,988 - Sakayori , et al. March 23, 2	2004-03-23
Laminate and use thereof App 20040043232 - Sakayori, Katsuya ; et al.	2004-03-04
Method and apparatus for controlling server Grant 6,697,836 - Kawano , et al. February 24, 2	2004-02-24
Wet etched insulator and electronic circuit component App 20030085451 - Sakayori, Katsuya ; et al.	2003-05-08
Production process of electronic component using wet etching, electronic component, and suspension for hard disk App 20030052078 - Sakayori, Katsuya ; et al.	2003-03-20
HDD suspension and its manufacture App 20020155710 - Okamura, Kazuto ; et al.	2002-10-24
Method of manufacturing wireless suspension blank App 20020027127 - Yagi, Hiroshi ; et al.	2002-03-07
Method of manufacturing wireless suspension blank App 20020003127 - Sakayori, Katsuya ; et al.	2002-01-10
Apparatus for filtering multicast messages transmitted between subnetworks based upon the message content Grant 5,933,605 - Kawano , et al. August 3, 1	1999-08-03
Method of communicating messages in a distributed processing system Grant 5,594,872 - Kawano , et al. January 14, 1	1997-01-14

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