loadpatents
Patent applications and USPTO patent grants for Kawanishi; Ayako.The latest application filed is for "semiconductor memory device".
Patent | Date |
---|---|
Semiconductor memory device having vertical semiconductor films with narrowing widths and gate insulating films with different thickness Grant 10,692,886 - Kasashima , et al. | 2020-06-23 |
Semiconductor Memory Device App 20200075624 - KASASHIMA; Shunsuke ;   et al. | 2020-03-05 |
Pattern Formation Method App 20180275519 - KAWANISHI; Ayako ;   et al. | 2018-09-27 |
Lithography pattern forming method using self-organizing block copolymer Grant 9,816,004 - Kawanishi , et al. November 14, 2 | 2017-11-14 |
Semiconductor device manufacturing method and pattern forming method Grant 9,685,331 - Kawanishi , et al. June 20, 2 | 2017-06-20 |
Pattern Forming Method App 20170076952 - KAWANISHI; Ayako ;   et al. | 2017-03-16 |
Pattern forming method Grant 9,371,427 - Kobayashi , et al. June 21, 2 | 2016-06-21 |
Pattern forming method Grant 9,279,191 - Kawanishi March 8, 2 | 2016-03-08 |
Pattern Forming Method App 20160060410 - KOBAYASHI; Katsutoshi ;   et al. | 2016-03-03 |
Pattern Forming Method App 20150151329 - KAWANISHI; Ayako ;   et al. | 2015-06-04 |
Pattern formation method Grant 9,040,123 - Kawanishi , et al. May 26, 2 | 2015-05-26 |
Pattern formation method Grant 9,040,429 - Kato , et al. May 26, 2 | 2015-05-26 |
Pattern forming method Grant 9,023,222 - Kawanishi , et al. May 5, 2 | 2015-05-05 |
Method of pattern formation Grant 8,980,755 - Kawanishi , et al. March 17, 2 | 2015-03-17 |
Pattern Forming Method App 20140295669 - KAWANISHI; Ayako ;   et al. | 2014-10-02 |
Pattern Formation Method App 20140248439 - SATO; Hironobu ;   et al. | 2014-09-04 |
Pattern Formation Method App 20140087566 - KATO; Hirokazu ;   et al. | 2014-03-27 |
Pattern Forming Method App 20140069325 - KAWANISHI; Ayako | 2014-03-13 |
Pattern Formation Method App 20140072722 - KAWANISHI; Ayako ;   et al. | 2014-03-13 |
Method Of Pattern Formation App 20140065839 - KAWANISHI; Ayako ;   et al. | 2014-03-06 |
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