Kawanabe; Naoki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawanabe; Naoki.The latest application filed is for "semiconductor device".

Company Profile

0.11.10

Kawanabe; Naoki - Kanagawa JP
Kawanabe; Naoki - Kawasaki JP
KAWANABE; Naoki - Kawasaki-shi JP
Kawanabe; Naoki - Tokyo JP
Kawanabe; Naoki - Kodaira JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 10,163,740 - Yasumura , et al. Dec	2018-12-25
Semiconductor Device App 20180040521 - YASUMURA; Bunji ; et al.	2018-02-08
Semiconductor device Grant 9,824,944 - Yasumura , et al. November 21, 2	2017-11-21
Semiconductor Device App 20170018470 - YASUMURA; Bunji ; et al.	2017-01-19
Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor device Grant 9,508,678 - Kawanabe November 29, 2	2016-11-29
Method of Manufacturing Semiconductor Device App 20150228618 - KAWANABE; Naoki	2015-08-13
Semiconductor Device App 20150137125 - Yasumura; Bunji ; et al.	2015-05-21
Semiconductor device Grant 8,946,705 - Yasumura , et al. February 3, 2	2015-02-03
Semiconductor device and a manufacturing method of the same Grant 8,530,278 - Muto , et al. September 10, 2	2013-09-10
Semiconductor Device And A Manufacturing Method Of The Same App 20110269268 - MUTO; NOBUYASU ; et al.	2011-11-03
Semiconductor device and a manufacturing method of the same Grant 7,981,788 - Muto , et al. July 19, 2	2011-07-19
Semiconductor Device App 20100295043 - YASUMURA; Bunji ; et al.	2010-11-25
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors Grant 7,449,786 - Kawanabe , et al. November 11, 2	2008-11-11
Semiconductor device and a manufacturing method of the same App 20070035002 - Moto; Nobuyasu ; et al.	2007-02-15
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors App 20060138679 - Kawanabe; Naoki ; et al.	2006-06-29
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors Grant 7,049,214 - Kawanabe , et al. May 23, 2	2006-05-23
Semiconductor device and a method of manufacturing the same Grant 7,015,127 - Nakajima , et al. March 21, 2	2006-03-21
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors App 20050035449 - Kawanabe, Naoki ; et al.	2005-02-17
Semiconductor device and a method of manufacturing the same App 20030168740 - Nakajima, Yasuyuki ; et al.	2003-09-11

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