loadpatents
Patent applications and USPTO patent grants for Kawamura; Youichirou.The latest application filed is for "method and apparatus for loading solder balls".
Patent | Date |
---|---|
Printed wiring board and a method of manufacturing a printed wiring board Grant 9,480,170 - Tanno , et al. October 25, 2 | 2016-10-25 |
Method And Apparatus For Loading Solder Balls App 20120067938 - Tanno; Katsuhiko ;   et al. | 2012-03-22 |
Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board App 20120031659 - TANNO; Katsuhiko ;   et al. | 2012-02-09 |
Method and apparatus for loading solder balls Grant 8,091,766 - Tanno , et al. January 10, 2 | 2012-01-10 |
Printed wiring board and a method of manufacturing a printed wiring board Grant 8,087,164 - Tanno , et al. January 3, 2 | 2012-01-03 |
Method for manufacturing a printed wiring board Grant 8,083,123 - Tanno , et al. December 27, 2 | 2011-12-27 |
Method For Manufacturing A Printed Wiring Board App 20090120680 - Tanno; Katsuhiko ;   et al. | 2009-05-14 |
Method And Apparatus For Loading Solder Balls App 20090026250 - TANNO; Katsuhiko ;   et al. | 2009-01-29 |
Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board App 20080302560 - Tanno; Katsuhiko ;   et al. | 2008-12-11 |
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