Kawamura; Youichirou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawamura; Youichirou.The latest application filed is for "method and apparatus for loading solder balls".

Company Profile

0.5.5

Kawamura; Youichirou - Ibi-gun N/A JP
Kawamura; Youichirou - Gifu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed wiring board and a method of manufacturing a printed wiring board Grant 9,480,170 - Tanno , et al. October 25, 2	2016-10-25
Method And Apparatus For Loading Solder Balls App 20120067938 - Tanno; Katsuhiko ; et al.	2012-03-22
Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board App 20120031659 - TANNO; Katsuhiko ; et al.	2012-02-09
Method and apparatus for loading solder balls Grant 8,091,766 - Tanno , et al. January 10, 2	2012-01-10
Printed wiring board and a method of manufacturing a printed wiring board Grant 8,087,164 - Tanno , et al. January 3, 2	2012-01-03
Method for manufacturing a printed wiring board Grant 8,083,123 - Tanno , et al. December 27, 2	2011-12-27
Method For Manufacturing A Printed Wiring Board App 20090120680 - Tanno; Katsuhiko ; et al.	2009-05-14
Method And Apparatus For Loading Solder Balls App 20090026250 - TANNO; Katsuhiko ; et al.	2009-01-29
Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board App 20080302560 - Tanno; Katsuhiko ; et al.	2008-12-11

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