Kawamura; Yoichiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawamura; Yoichiro.The latest application filed is for "multilayer printed wiring board".
Company Profile
0.29.20
- Kawamura; Yoichiro - Ibi-gun JP
- Kawamura; Yoichiro - Gifu N/A JP
- Kawamura; Yoichiro - Ogaki JP
- Kawamura; Yoichiro - Ogaki-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Multilayer printed wiring board Grant 9,040,843 - Toyoda , et al. May 26, 2 | 2015-05-26 |
| Method of manufacturing a printed wiring board Grant 8,832,935 - Kawamura , et al. September 16, 2 | 2014-09-16 |
| Printed wiring board Grant 8,624,132 - Kawamura , et al. January 7, 2 | 2014-01-07 |
| Multilayer wiring board and method for manufacturing the same Grant 8,525,041 - Shimizu , et al. September 3, 2 | 2013-09-03 |
| Circuit board for mounting electronic parts Grant RE44,251 - Asai , et al. June 4, 2 | 2013-06-04 |
| Multilayer Printed Wiring Board App 20130008701 - TOYODA; Yukihiko ; et al. | 2013-01-10 |
| Multilayer printed wiring board Grant 8,324,512 - Toyoda , et al. December 4, 2 | 2012-12-04 |
| Wiring board and method for manufacturing the same Grant 8,222,539 - Kawamura , et al. July 17, 2 | 2012-07-17 |
| Printed wiring board Grant 8,198,546 - Kawamura , et al. June 12, 2 | 2012-06-12 |
| Multilayer printed wiring board Grant 8,030,579 - Toyoda , et al. October 4, 2 | 2011-10-04 |
| Printed wiring board Grant 8,022,314 - Kawamura , et al. September 20, 2 | 2011-09-20 |
| Printed wiring board Grant 8,017,875 - Kawamura , et al. September 13, 2 | 2011-09-13 |
| Printed Wiring Board App 20110214915 - KAWAMURA; Yoichiro ; et al. | 2011-09-08 |
| Printed wiring board Grant 8,003,897 - Kawamura , et al. August 23, 2 | 2011-08-23 |
| Solder ball loading method Grant 8,001,683 - Kawamura , et al. August 23, 2 | 2011-08-23 |
| Multilayer Printed Wiring Board App 20110108311 - TOYODA; Yukihiko ; et al. | 2011-05-12 |
| Printed Wiring Board App 20110061232 - Kawamura; Yoichiro ; et al. | 2011-03-17 |
| Solder ball loading method and solder ball loading unit Grant 7,866,529 - Sumita , et al. January 11, 2 | 2011-01-11 |
| Manufacturing method and manufacturing apparatus of printed wiring board Grant 7,823,762 - Kawamura , et al. November 2, 2 | 2010-11-02 |
| Wiring Board And Method For Manufacturing The Same App 20100224397 - Shimizu; Keisuke ; et al. | 2010-09-09 |
| Multilayer Wiring Board And Method For Manufacturing The Same App 20100214752 - Shimizu; Keisuke ; et al. | 2010-08-26 |
| Wiring Board And Method For Manufacturing The Same App 20100212946 - SHIMIZU; Keisuke ; et al. | 2010-08-26 |
| Printed Wiring Board App 20100155129 - KAWAMURA; Yoichiro ; et al. | 2010-06-24 |
| Wiring Board And Method For Manufacturing The Same App 20100155124 - Kawamura; Yoichiro ; et al. | 2010-06-24 |
| Printed wiring board Grant 7,714,233 - Kawamura , et al. May 11, 2 | 2010-05-11 |
| Printed Wiring Board App 20100065323 - Kawamura; Yoichiro ; et al. | 2010-03-18 |
| Solder Ball Loading Method And Solder Ball Loading Unit App 20090084827 - SUMITA; Atsunori ; et al. | 2009-04-02 |
| Solder ball loading method and solder ball loading unit background of the invention Grant 7,475,803 - Sumita , et al. January 13, 2 | 2009-01-13 |
| Solder ball loading apparatus Grant 7,472,473 - Kawamura , et al. January 6, 2 | 2009-01-06 |
| Multilayer Printed Wiring Board App 20080190658 - TOYODA; Yukihiko ; et al. | 2008-08-14 |
| Printed Wiring Board App 20080149369 - KAWAMURA; Yoichiro ; et al. | 2008-06-26 |
| Solder Ball Loading Method And Solder Ball Loading Apparatus App 20080120832 - KAWAMURA; Yoichiro ; et al. | 2008-05-29 |
| Multilayer printed wiring board Grant 7,371,974 - Toyoda , et al. May 13, 2 | 2008-05-13 |
| Manufacturing method and manufacturing apparatus of printed wiring board App 20080078810 - Kawamura; Yoichiro ; et al. | 2008-04-03 |
| Solder ball loading method and solder ball loading apparatus App 20070251089 - Kawamura; Yoichiro ; et al. | 2007-11-01 |
| Printed wiring board App 20070096327 - Kawamura; Yoichiro ; et al. | 2007-05-03 |
| Printed wiring board App 20070086147 - Kawamura; Yoichiro ; et al. | 2007-04-19 |
| Solder ball loading method and solder ball loading unit background of the invention App 20060157540 - Sumita; Atsunori ; et al. | 2006-07-20 |
| Multilayer printed circuit board Grant 6,831,234 - Asai , et al. December 14, 2 | 2004-12-14 |
| Multilayered printed wiring board App 20030178229 - Toyoda, Yukihiko ; et al. | 2003-09-25 |
| Circuit board for mounting electronic parts Grant 6,384,344 - Asai , et al. May 7, 2 | 2002-05-07 |
| Printed wiring board and manufacturing method thereof Grant 6,342,682 - Mori , et al. January 29, 2 | 2002-01-29 |
| Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler Grant 6,217,988 - Yasue , et al. April 17, 2 | 2001-04-17 |
| Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler Grant 6,010,768 - Yasue , et al. January 4, 2 | 2000-01-04 |
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