KAWAMURA; Toshifumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAWAMURA; Toshifumi.The latest application filed is for "apparatus for analyzing composition of electronic and electrical device part scraps, device for processing electronic and electrical device part scraps, and method for processing electronic and electrical device part scraps".

Company Profile

0.6.10

KAWAMURA; Toshifumi - Hitachi-shi JP
Kawamura; Toshifumi - Hitachi JP
Kawamura; Toshifumi - Kitaibaraki JP
Kawamura; Toshifumi - Ibaraki JP
Kawamura, Toshifumi - Kashima-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus For Analyzing Composition Of Electronic And Electrical Device Part Scraps, Device For Processing Electronic And Electrical Device Part Scraps, And Method For Processing Electronic And Electrical Device Part Scraps App 20220005171 - GODA; Tomonari ; et al.	2022-01-06
Polyoxometalate and method for producing polyoxometalate Grant 10,647,589 - Kawamura	2020-05-12
Method for recovering at least one valuable containing tungsten Grant 10,538,849 - Kawamura Ja	2020-01-21
Method for producing tungsten Grant 10,422,022 - Kawamura Sept	2019-09-24
Method for producing tungsten carbide Grant 10,227,235 - Kawamura	2019-03-12
Method For Recovering At Least One Valuable Containing Tungsten App 20180087166 - KAWAMURA; Toshifumi	2018-03-29
Method For Producing Tungsten App 20180080101 - KAWAMURA; Toshifumi	2018-03-22
Method For Producing Tungsten Carbide App 20180072576 - KAWAMURA; Toshifumi	2018-03-15
Polyoxometalate And Method For Producing Polyoxometalate App 20180065862 - KAWAMURA; Toshifumi	2018-03-08
Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material Grant 8,043,705 - Kawamura , et al. October 25, 2	2011-10-25
Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating Grant 7,713,340 - Kawamura , et al. May 11, 2	2010-05-11
Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material App 20080138629 - Kawamura; Toshifumi ; et al.	2008-06-12
Pretreating Agent For Electroless Plating, Method Of Electroless Plating Using The Same And Product Of Electroless Plating App 20080014362 - Kawamura; Toshifumi ; et al.	2008-01-17
Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate App 20070269680 - Kawamura; Toshifumi ; et al.	2007-11-22
Inkjet ink composition App 20070120880 - Kawamura; Toshifumi ; et al.	2007-05-31
Graphite material for negative electrode of lithium ion secondary battery and process for producing the same App 20020160266 - Yamazaki, Yoshinori ; et al.	2002-10-31

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