Kawamura; Takatoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawamura; Takatoshi.The latest application filed is for "bonding tool cooling apparatus and method for cooling bonding tool".
- Kawamura; Takatoshi - Tokyo JP
- Kawamura; Takatoshi - Yamanashi JP
- Kawamura; Takatoshi - Akishima JP
- Kawamura, Takatoshi - Minamitsuru-gun JP
- Kawamura, Takatoshi - Akishima-shi JP
| Patent | Date |
|---|---|
| Bonding tool cooling apparatus and method for cooling bonding tool Grant 9,576,927 - Kakutani , et al. February 21, 2 | 2017-02-21 |
| Bonding Tool Cooling Apparatus And Method For Cooling Bonding Tool App 20150333032 - KAKUTANI; OSAMU ; et al. | 2015-11-19 |
| Temperature control method and apparatus for injection molding structure Grant 6,861,018 - Koyama , et al. March 1, 2 | 2005-03-01 |
| Workpiece retainer for a bonding apparatus Grant 6,651,868 - Kawamura November 25, 2 | 2003-11-25 |
| Temperature control method and apparatus for injection molding machine App 20030047828 - Koyama, Hideki ; et al. | 2003-03-13 |
| Workpiece retainer for a bonding apparatus App 20020096552 - Kawamura, Takatoshi | 2002-07-25 |
| Spool holder structure for a wire bonder App 20010002038 - Terakado, Yoshimitsu ; et al. | 2001-05-31 |
| Microscope supporting mechanism Grant 5,320,315 - Kawamura , et al. June 14, 1 | 1994-06-14 |
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