loadpatents
name:-0.0010218620300293
name:-0.0019350051879883
name:-0.00046801567077637
Kawamura; Reeko Patent Filings

Kawamura; Reeko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawamura; Reeko.The latest application filed is for "self-bonding silicone compositions".

Company Profile
0.1.0
  • Kawamura; Reeko - Ohaza Ushizawa Ohta-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Self-bonding silicone compositions
Grant 4,257,936 - Matsumoto , et al. March 24, 1
1981-03-24

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