Kawamura; Norifumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawamura; Norifumi.The latest application filed is for "heat-curable maleimide resin composition and semiconductor device".

Company Profile

11.14.14

Kawamura; Norifumi - Annaka JP
KAWAMURA; Norifumi - Annaka-shi JP
Kawamura; Norifumi - Yamagata JP
KAWAMURA; Norifumi - Yonezawa JP
Kawamura; Norifumi - Fujisawa N/A JP
Kawamura; Norifumi - Kyoto JP
Kawamura, Norifumi - Fujisawa-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat-curable resin composition and semiconductor device Grant 11,059,973 - Tsutsumi , et al. July 13, 2	2021-07-13
Heat-curable resin composition for semiconductor encapsulation and semiconductor device Grant 11,046,848 - Tsutsumi , et al. June 29, 2	2021-06-29
Silicone-modified epoxy resin composition and semiconductor device Grant 11,028,269 - Kawamura , et al. June 8, 2	2021-06-08
Heat-curable resin composition for semiconductor encapsulation and semiconductor device Grant 11,001,704 - Tsutsumi , et al. May 11, 2	2021-05-11
Heat-curable Maleimide Resin Composition And Semiconductor Device App 20210024749 - OSADA; Shoichi ; et al.	2021-01-28
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device App 20210002474 - OSADA; Shoichi ; et al.	2021-01-07
Silicone-modified Epoxy Resin Composition And Semiconductor Device App 20200392340 - KAWAMURA; Norifumi ; et al.	2020-12-17
Heat-curable resin composition for semiconductor encapsulation and semiconductor device Grant 10,793,712 - Tsutsumi , et al. October 6, 2	2020-10-06
Silicone-modified epoxy resin composition and semiconductor device Grant 10,676,635 - Kawamura , et al.	2020-06-09
Heat-curable Resin Composition And Semiconductor Device App 20200048464 - TSUTSUMI; Yoshihiro ; et al.	2020-02-13
Heat-curable Resin Composition For Semiconductor Encapsulation And Semiconductor Device App 20200048455 - TSUTSUMI; Yoshihiro ; et al.	2020-02-13
Heat-curable Resin Composition For Semiconductor Encapsulation And Semiconductor Device App 20200048454 - TSUTSUMI; Yoshihiro ; et al.	2020-02-13
Silicone-modified Epoxy Resin Composition And Semiconductor Device App 20190144704 - KAWAMURA; Norifumi ; et al.	2019-05-16
Semiconductor Encapsulating Resin Composition and Semiconductor Device App 20190127580 - Osada; Shoichi ; et al.	2019-05-02
Silicone-modified Epoxy Resin Composition And Semiconductor Device App 20180334567 - KAWAMURA; Norifumi ; et al.	2018-11-22
Organic electroluminescent lighting device Grant 9,966,571 - Furukawa , et al. May 8, 2	2018-05-08
Organic Electroluminescent Lighting Device App 20160126502 - FURUKAWA; Tadahiro ; et al.	2016-05-05
Organic electroluminescent device and production process thereof Grant 9,203,046 - Kido , et al. December 1, 2	2015-12-01
Organic devices, organic electroluminescent devices, organic solar cells, organic FET structures and production method of organic devices Grant 9,196,850 - Matsumoto , et al. November 24, 2	2015-11-24
Organic electroluminescent device Grant 8,558,451 - Kido , et al. October 15, 2	2013-10-15
Organic EL device Grant 8,227,980 - Kawamura , et al. July 24, 2	2012-07-24
Organic El Device App 20110025197 - Kawamura; Norifumi ; et al.	2011-02-03
Organic devices, organic electroluminescent devices, organic solar cells, organic FET structures and production method of organic devices App 20050098207 - Matsumoto, Toshio ; et al.	2005-05-12
Organic electroluminescent device App 20050084712 - Kido, Junji ; et al.	2005-04-21
Organic electroluminescent device and production process thereof App 20050084713 - Kido, Junji ; et al.	2005-04-21

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