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Patent applications and USPTO patent grants for KAWAMURA; Keizo.The latest application filed is for "coil component and electronic device".
Patent | Date |
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Coil Component And Electronic Device App 20210375532 - KAWAMURA; Keizo ;   et al. | 2021-12-02 |
Coil component and electronic device Grant 11,139,105 - Kawamura , et al. October 5, 2 | 2021-10-05 |
Coil Component And Electronic Device App 20190198231 - KAWAMURA; Keizo ;   et al. | 2019-06-27 |
Coil Component And Electronic Device App 20190198226 - KAWAMURA; Keizo ;   et al. | 2019-06-27 |
Electronic component Grant 9,984,811 - Hayashi , et al. May 29, 2 | 2018-05-29 |
Electronic Component App 20160372260 - HAYASHI; Masahiro ;   et al. | 2016-12-22 |
Electronic component Grant 9,460,843 - Hayashi , et al. October 4, 2 | 2016-10-04 |
Electronic Component App 20150035635 - HAYASHI; Masahiro ;   et al. | 2015-02-05 |
Ceramic composition and ceramic wiring board Grant 7,176,154 - Kataoka , et al. February 13, 2 | 2007-02-13 |
Ceramic composition and ceramic wiring board App 20060040819 - Kataoka; Hakuo ;   et al. | 2006-02-23 |
Low thermal resistant, fluid-cooled semiconductor module Grant 5,774,334 - Kawamura , et al. June 30, 1 | 1998-06-30 |
Cooling device of semiconductor chips Grant RE35,721 - Daikoku , et al. February 3, 1 | 1998-02-03 |
Cooling device of semiconductor chips Grant 4,770,242 - Daikoku , et al. September 13, 1 | 1988-09-13 |
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