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KAWAMURA; Keizo Patent Filings

KAWAMURA; Keizo

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAWAMURA; Keizo.The latest application filed is for "coil component and electronic device".

Company Profile
2.7.6
  • KAWAMURA; Keizo - Takasaki-shi JP
  • Kawamura; Keizo - Takasaki JP
  • Kawamura; Keizo - Tokyo JP
  • Kawamura; Keizo - Taito-ku JP
  • Kawamura; Keizo - Ibaraki-ken JP
  • Kawamura; Keizo - Shimoinayoshi JP
  • Kawamura; Keizo - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Coil Component And Electronic Device
App 20210375532 - KAWAMURA; Keizo ;   et al.
2021-12-02
Coil component and electronic device
Grant 11,139,105 - Kawamura , et al. October 5, 2
2021-10-05
Coil Component And Electronic Device
App 20190198231 - KAWAMURA; Keizo ;   et al.
2019-06-27
Coil Component And Electronic Device
App 20190198226 - KAWAMURA; Keizo ;   et al.
2019-06-27
Electronic component
Grant 9,984,811 - Hayashi , et al. May 29, 2
2018-05-29
Electronic Component
App 20160372260 - HAYASHI; Masahiro ;   et al.
2016-12-22
Electronic component
Grant 9,460,843 - Hayashi , et al. October 4, 2
2016-10-04
Electronic Component
App 20150035635 - HAYASHI; Masahiro ;   et al.
2015-02-05
Ceramic composition and ceramic wiring board
Grant 7,176,154 - Kataoka , et al. February 13, 2
2007-02-13
Ceramic composition and ceramic wiring board
App 20060040819 - Kataoka; Hakuo ;   et al.
2006-02-23
Low thermal resistant, fluid-cooled semiconductor module
Grant 5,774,334 - Kawamura , et al. June 30, 1
1998-06-30
Cooling device of semiconductor chips
Grant RE35,721 - Daikoku , et al. February 3, 1
1998-02-03
Cooling device of semiconductor chips
Grant 4,770,242 - Daikoku , et al. September 13, 1
1988-09-13

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