Kawamoto; Yoshihisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawamoto; Yoshihisa.The latest application filed is for "die used for resin-sealing and molding an electronic component".
- Kawamoto; Yoshihisa - Kyoto JP
| Patent | Date |
|---|---|
| Die used for resin-sealing and molding an electronic component Grant 6,773,247 - Osada , et al. August 10, 2 | 2004-08-10 |
| Method of and apparatus for molding resin to seal electronic parts Grant 5,834,035 - Osada , et al. November 10, 1 | 1998-11-10 |
| Method of sealing electronic parts with molded resin and mold employed therefor Grant 5,753,538 - Kuno , et al. May 19, 1 | 1998-05-19 |
| Method of molding resin to seal electronic parts using two evacuation steps Grant 5,603,879 - Osada , et al. February 18, 1 | 1997-02-18 |
| Resin molding apparatus for sealing an electronic device Grant 5,507,633 - Osada , et al. April 16, 1 | 1996-04-16 |
| Method of molding resin for sealing an electronic device Grant 5,435,953 - Osada , et al. July 25, 1 | 1995-07-25 |
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