Kawamoto; Mineo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawamoto; Mineo.The latest application filed is for "printed wiring board with built-in semiconductor element, and process for producing the same".

Company Profile

0.13.1

Kawamoto; Mineo - Kitakanbara-gun JP
Kawamoto; Mineo - Hitachi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed wiring board with built-in semiconductor element, and process for producing the same Grant 8,035,979 - Yoshino , et al. October 11, 2	2011-10-11
Printed Wiring Board With Built-in Semiconductor Element, And Process For Producing The Same App 20110090657 - YOSHINO; Yutaka ; et al.	2011-04-21
Printed wiring board with built-in semiconductor element, and process for producing the same Grant 7,894,200 - Yoshino , et al. February 22, 2	2011-02-22
Photosensitive resin composition, and multilayer printed circuit board using the same Grant 6,190,834 - Narahara , et al. February 20, 2	2001-02-20
Multilayer circuit board and photosensitive resin composition used therefor Grant 5,914,216 - Amou , et al. June 22, 1	1999-06-22
Photosensitive resin composition and method for using the same in manufacture of circuit boards Grant 5,849,460 - Kawai , et al. December 15, 1	1998-12-15
Process for producing printed circuit board Grant 5,028,513 - Murakami , et al. July 2, 1	1991-07-02
Process for producing printed circuit board Grant 4,876,177 - Akahoshi , et al. October 24, 1	1989-10-24
Process for electroless copper plating Grant 4,632,852 - Akahoshi , et al. December 30, 1	1986-12-30
Printed circuit board, process for preparing the same and resist ink used therefor Grant 4,610,910 - Kawamoto , et al. September 9, 1	1986-09-09
Method for manufacture of printed wiring board Grant 4,604,160 - Murakami , et al. August 5, 1	1986-08-05
Process for producing printed circuit board by electroless plating Grant 4,378,384 - Murakami , et al. March 29, 1	1983-03-29
Method for production of printed circuits by electroless metal plating Grant 4,293,592 - Morishita , et al. October 6, 1	1981-10-06
Electroless copper solution Grant 4,099,974 - Morishita , et al. July 11, 1	1978-07-11

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