KAWAMOTO; Eiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAWAMOTO; Eiji.The latest application filed is for "intradermal needle, packaged article, and injection device".

Company Profile

1.19.20

KAWAMOTO; Eiji - Kanagawa JP
KAWAMOTO; Eiji - Ashigarakami-gun Kanagawa
Kawamoto; Eiji - Osaka JP
Kawamoto; Eiji - Tokyo-to JP
Kawamoto; Eiji - Ibaraki JP
Kawamoto, Eiji - Ibaraki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Intradermal Needle, Packaged Article, And Injection Device App 20200206434 - MAEKAWA; Minami ; et al.	2020-07-02
Syringe with hanging tag Grant 9,962,491 - Watanabe , et al. May 8, 2	2018-05-08
Injection Needle Assembly, And Drug Injection Device App 20180015231 - Kawamoto; Eiji	2018-01-18
Syringe With Hanging Tag App 20150352286 - WATANABE; Eiji ; et al.	2015-12-10
Elastic wave device and electronic device using the same Grant 8,704,424 - Yamaji , et al. April 22, 2	2014-04-22
Acoustic wave element and electronic device including the same Grant 8,564,171 - Yamaji , et al. October 22, 2	2013-10-22
Elastic Wave Device And Electronic Device Using The Same App 20130257221 - YAMAJI; Toru ; et al.	2013-10-03
Elastic wave device and electronic device using the same Grant 8,471,433 - Yamaji , et al. June 25, 2	2013-06-25
Projector-type headlight and configuration structure of resin projector lens thereof Grant 8,382,352 - Yatsuda , et al. February 26, 2	2013-02-26
Acoustic wave device and electronic apparatus using the same Grant 8,334,737 - Yamaji , et al. December 18, 2	2012-12-18
Acoustic Wave Element And Electronic Device Including The Same App 20120086309 - YAMAJI; Toru ; et al.	2012-04-12
Projector-type Headlight And Configuration Structure Of Resin Projector Lens Thereof App 20110170306 - YATSUDA; Yasushi ; et al.	2011-07-14
Passive component incorporating interposer Grant 7,968,800 - Sasaoka , et al. June 28, 2	2011-06-28
Elastic Wave Device And Electronic Device Using The Same App 20110084573 - YAMAJI; Toru ; et al.	2011-04-14
Acoustic Wave Device And Electronic Apparatus Using The Same App 20110012695 - Yamaji; Toru ; et al.	2011-01-20
Method of manufacturing clad board for forming circuitry, clad board and core board for clad board Grant 7,754,321 - Yamane , et al. July 13, 2	2010-07-13
Passive Component Incorporating Interposer App 20100155119 - Sasaoka; Tatsuo ; et al.	2010-06-24
Method Of Manufacturing Component-embedded Printed Wiring Board App 20100146779 - HONJO; Kazuhiko ; et al.	2010-06-17
Component-embedded Printed Wiring Board App 20100147569 - Honjo; Kazuhiko ; et al.	2010-06-17
Method of manufacturing component-embedded printed wiring board Grant 7,694,415 - Honjo , et al. April 13, 2	2010-04-13
Multilayer module and method of manufacturing the same Grant 7,532,485 - Kimura , et al. May 12, 2	2009-05-12
Circuit-component-containing module Grant 7,382,628 - Kawamoto , et al. June 3, 2	2008-06-03
Component-embedded printed wiring board and method of manufacturing the same App 20060260122 - Honjo; Kazuhiko ; et al.	2006-11-23
Multilayer module and method of manufacturing the same App 20060261472 - Kimura; Junichi ; et al.	2006-11-23
Electronic component-built-in module Grant 6,998,532 - Kawamoto , et al. February 14, 2	2006-02-14
Method of manufacturing clad board for forming circuitry, clad board and core board for clad board App 20050249933 - Yamane, Shigeru ; et al.	2005-11-10
Method for manufacturing printed-circuit board Grant 6,890,449 - Kawamoto , et al. May 10, 2	2005-05-10
Circuit-component-containing module App 20050051358 - Kawamoto, Eiji ; et al.	2005-03-10
Electronic component-built-in module App 20050013082 - Kawamoto, Eiji ; et al.	2005-01-20
Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board Grant 6,833,042 - Yamane , et al. December 21, 2	2004-12-21
Circuit forming board producing method, circuit forming board, and material for circuit forming board App 20030091787 - Yamane, Shigeru ; et al.	2003-05-15
Method of manufacturing printed circuit board Grant 6,523,258 - Kawamoto , et al. February 25, 2	2003-02-25
Method for manufacturing printed-circuit board App 20020170876 - Kawamoto, Eiji ; et al.	2002-11-21
Manufacturing Method Of Wiring Board, And Conductive Paste Used Therein App 20020056509 - MIURA, KAZUHIRO ; et al.	2002-05-16
Method of manufacturing ceramic substrate Grant 6,374,733 - Hayama , et al. April 23, 2	2002-04-23
Method of manufacturing printed circuit board App 20010025415 - Kawamoto, Eiji ; et al.	2001-10-04

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