Kawakita; Yoshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawakita; Yoshihiro.The latest application filed is for "mounting pedestal, component mounting module, and moving body".

Company Profile

1.17.21

Kawakita; Yoshihiro - Osaka JP
Kawakita; Yoshihiro - Gunma JP
Kawakita; Yoshihiro - Yokohama-Shi JP
Kawakita; Yoshihiro - Katano JP
Kawakita; Yoshihiro - Shijonawate JP
Kawakita, Yoshihiro - Katano-shi JP
Kawakita, Yoshihiro - Shijonawate-shi JP
Kawakita; Yoshihiro - Neyagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mounting pedestal, component mounting module, and moving body Grant 10,703,261 - Nakano , et al.	2020-07-07
Mounting Pedestal, Component Mounting Module, And Moving Body App 20180370421 - NAKANO; Tomoyuki ; et al.	2018-12-27
Ink Composition For Water-based Ballpoint Pen App 20150040797 - Itou; Hiroyuki ; et al.	2015-02-12
Water-based Ink Composition For Ballpoint Pen App 20130087070 - Itou; Hiroyuki ; et al.	2013-04-11
Method of manufacturing circuit forming board Grant 8,069,557 - Nishii , et al. December 6, 2	2011-12-06
Method of manufacturing multi-layer circuit board Grant 8,007,629 - Takenaka , et al. August 30, 2	2011-08-30
Intermediate material for manufacturing circuit board and method for manufacturing circuit board using such intermediate material Grant 7,828,924 - Kawakita , et al. November 9, 2	2010-11-09
Circuit board Grant 7,816,611 - Takenaka , et al. October 19, 2	2010-10-19
Intermediate Material For Manufacturing Circuit Board And Method For Manufacturing Circuit Board Using Such Intermediate Material App 20090114338 - Kawakita; Yoshihiro ; et al.	2009-05-07
Method of Manufacturing Multi-Layer Circuit Board App 20080251193 - Takenaka; Toshiaki ; et al.	2008-10-16
Circuit-formed substrate and method of manufacturing circuit-formed substrate Grant 7,356,916 - Nishii , et al. April 15, 2	2008-04-15
Method of manufacturing circuit board Grant 7,281,325 - Kawakita , et al. October 16, 2	2007-10-16
Circuit Board App 20070107931 - Takenaka; Toshiaki ; et al.	2007-05-17
Method for producing a circuit board Grant 7,181,839 - Takenaka , et al. February 27, 2	2007-02-27
Method of manufacturing a double-sided circuit board Grant 7,174,632 - Kawakita , et al. February 13, 2	2007-02-13
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board App 20060283626 - Suzuki; Takeshi ; et al.	2006-12-21
Process for manufacturing a circuit board Grant 7,103,971 - Suzuki , et al. September 12, 2	2006-09-12
Method of manufacturing circuit board Grant 7,047,629 - Kokufu , et al. May 23, 2	2006-05-23
Method of manufactruing circuit board App 20060064871 - Kawakita; Yoshihiro ; et al.	2006-03-30
Circuit formation substrate manufacturing method and circuit formation substrate material App 20050198818 - Nishii, Toshihiro ; et al.	2005-09-15
Circuit substrate having improved connection reliability and a method for manufacturing the same Grant 6,930,395 - Tomekawa , et al. August 16, 2	2005-08-16
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board App 20050139384 - Suzuki, Takeshi ; et al.	2005-06-30
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board Grant 6,866,892 - Suzuki , et al. March 15, 2	2005-03-15
Circuit board and process for producing the same App 20050006139 - Takenaka, Toshiaki ; et al.	2005-01-13
Circuit board electrically insulating material, circuit board and method for manufacturing the same App 20040142161 - Kawakita, Yoshihiro ; et al.	2004-07-22
Circuit board having an interstitial inner via hole structure Grant 6,734,375 - Kawakita , et al. May 11, 2	2004-05-11
Circuit board and its manufacture method App 20040080918 - Kokufu, Shinobu ; et al.	2004-04-29
Circuit board and its manufacture method Grant 6,713,688 - Kokufu , et al. March 30, 2	2004-03-30
Circuit-formed subtrate and method of manufacturing circuit-formed substrate App 20040058136 - Nishii, Toshihiro ; et al.	2004-03-25
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board App 20040005443 - Suzuki, Takeshi ; et al.	2004-01-08
Non-woven fabric material and prepreg, and circuit board using the same App 20030045164 - Echigo, Fumio ; et al.	2003-03-06
Circuit board and its manufacture method App 20020131248 - Kokufu, Shinobu ; et al.	2002-09-19
Circuit Substrate and manufacturing method thereof App 20020066961 - Tomekawa, Satoru ; et al.	2002-06-06
Circuit board electrically insulating material, circuit board and method for manufacturing the same App 20020053465 - Kawakita, Yoshihiro ; et al.	2002-05-09
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board App 20020037397 - Suzuki, Takeshi ; et al.	2002-03-28
Printed circuit board and method for producing the same Grant 6,174,589 - Kawakita , et al. January 16, 2	2001-01-16
Substrate for printed circuit board Grant 6,015,872 - Kawakita , et al. January 18, 2	2000-01-18

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