Kawakita; Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawakita; Jin.The latest application filed is for "condensation detection element".

Company Profile

7.13.17

Kawakita; Jin - Ibaraki JP
Kawakita; Jin - Tsukuba JP
Kawakita; Jin - Tsukuba-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dew point measuring method and dew point measuring device Grant 11,454,603 - Kawakita , et al. September 27, 2	2022-09-27
Condensation Detection Element App 20220003701 - KAWAKITA; Jin	2022-01-06
Droplet size determining device and droplet size determining method Grant 10,830,573 - Kawakita , et al. November 10, 2	2020-11-10
Dryness/wetness Responsive Sensor App 20200249185 - Kind Code	2020-08-06
Method And System For Preventing Dew Condensation And Light Scattering Due To Dew Condensation App 20200053837 - KAWAKITA; Jin ; et al.	2020-02-13
Dew Point Measuring Method And Dew Point Measuring Device App 20190310213 - KAWAKITA; Jin ; et al.	2019-10-10
Droplet Size Determining Device And Droplet Size Determining Method App 20190178621 - KAWAKITA; Jin ; et al.	2019-06-13
DRYNESS/WETNESS RESPONSIVE SENSOR HAVING FIRST AND SECOND WIRES SPACED 5 nm TO LESS THAN 20 um APART App 20190145920 - KAWAKITA; Jin ; et al.	2019-05-16
Dryness/wetness responsive sensor having first and second wires spaced 5 nm to less than 20 .mu.m apart Grant 10,267,756 - Kawakita , et al.	2019-04-23
Process for precipitation of conducting polymer/metal composites, and conducting polymer/metal composites Grant 10,043,598 - Kawakita , et al. August 7, 2	2018-08-07
High-sensitivity multilayer resist film and method of increasing photosensitivity of resist film Grant 9,703,197 - Kawakita , et al. July 11, 2	2017-07-11
High-speed Response/high-sensitivity Dryness/wetness Responsive Sensor App 20170167995 - KAWAKITA; Jin ; et al.	2017-06-15
Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material Grant 9,622,346 - Kawakita , et al. April 11, 2	2017-04-11
Silver Diffusion Barrier Material, Silver Diffusion Barrier, And Semiconductor Device Using The Same App 20170084538 - KAWAKITA; Jin ; et al.	2017-03-23
High-sensitivity Multilayer Resist Film And Method Of Increasing Photosensitivity Of Resist Film App 20160238937 - KAWAKITA; Jin ; et al.	2016-08-18
Adhesive Body Between Conductive Polymer-metal Complex And Substrate And Method For Forming The Same, Conductive Polymer-metal Complex Dispersion Liquid, Method For Manufacturing The Same And Method For Applying The Same, And Method For Filling Hole Using Conductive Material App 20150282310 - Kawakita; Jin ; et al.	2015-10-01
Warm spray coating method and particles used therefor Grant 8,802,192 - Kawakita , et al. August 12, 2	2014-08-12
Resin Coated Member And Method Of Resin Coating App 20140199516 - KAWAKITA; Jin ; et al.	2014-07-17
Process For Precipitation Of Conducting Polymer/metal Composites, And Conducting Polymer/metal Composites App 20140162061 - Kawakita; Jin ; et al.	2014-06-12
Resin coated member and method of resin coating Grant 8,637,121 - Kawakita , et al. January 28, 2	2014-01-28
Hetero pn junction semiconductor and process for producing the same Grant 8,563,975 - Kawakita October 22, 2	2013-10-22
HETERO pn JUNCTION SEMICONDUCTOR AND PROCESS FOR PRODUCING THE SAME App 20120032166 - Kawakita; Jin	2012-02-09
Alloy Particle And Wire Used In Air Plasma Spray Or Wire Arc Spray App 20110168056 - Kuroda; Seiji ; et al.	2011-07-14
Resin Coated Member And Method Of Resin Coating App 20100183842 - Kawakita; Jin ; et al.	2010-07-22
Warm Spray Coating Method And Particles Used Therefor App 20100136229 - Kawakita; Jin ; et al.	2010-06-03

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