Kawakami; Toshio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawakami; Toshio.The latest application filed is for "bga package semiconductor device and inspection method therefor".
- Kawakami; Toshio - Kakogawa JP
- Kawakami; Toshio - Suita JP
- Kawakami; Toshio - Ibaraki JP
- Kawakami; Toshio - Zama JP
- Kawakami; Toshio - Mito JA
| Patent | Date |
|---|---|
| BGA package semiconductor device and inspection method therefor Grant 5,986,460 - Kawakami November 16, 1 | 1999-11-16 |
| IC chip mounting method Grant 5,048,179 - Shindo , et al. September 17, 1 | 1991-09-17 |
| Nuclear power plant providing a function of suppressing the deposition of radioactive substance Grant 4,722,823 - Honda , et al. February 2, 1 | 1988-02-02 |
| Thermal print head driving system Grant 4,688,051 - Kawakami , et al. August 18, 1 | 1987-08-18 |
| Method and apparatus for controlling tool magazines Grant 4,581,810 - Kawakami , et al. April 15, 1 | 1986-04-15 |
| Method of manufacturing a stainless steel boiler tube with anticorrosive coating Grant 3,969,153 - Suzuki , et al. July 13, 1 | 1976-07-13 |
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