Kawakami; Takamasa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawakami; Takamasa.The latest application filed is for "process for producing copper clad laminate".
- Kawakami; Takamasa - Ibaraki JP
- Kawakami; Takamasa - Tsukuba JP
- Kawakami; Takamasa - Niigata JP
| Patent | Date |
|---|---|
| Process for producing copper clad laminate Grant 5,382,333 - Ando , et al. January 17, 1 | 1995-01-17 |
| Method of preserving article with an oxygen absorbent composition Grant 5,378,428 - Inoue , et al. January 3, 1 | 1995-01-03 |
| Process for the production of fine powder Grant 5,250,101 - Hidaka , et al. October 5, 1 | 1993-10-05 |
| Silicon nitride-silicon carbide composite material and process for production thereof Grant 5,134,097 - Niihara , et al. July 28, 1 | 1992-07-28 |
| Process of producing copper plated resin article Grant 5,106,462 - Kawakami , et al. April 21, 1 | 1992-04-21 |
| Silicon nitride-silicon carbide composite material and process for production thereof Grant 4,800,182 - Izaki , et al. January 24, 1 | 1989-01-24 |
| Fine amorphous powder and process for preparing fine powdery mixture of silicon nitride and silicon carbide Grant 4,594,330 - Suzuki , et al. June 10, 1 | 1986-06-10 |
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