Kawakami; Shin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawakami; Shin.The latest application filed is for "printed wiring board having an electromagnetic wave shielding layer".

Company Profile

0.17.0

Kawakami; Shin - Iruma JP
Kawakami; Shin - Saitama JP
Kawakami; Shin - Fujikubo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed wiring board having an electromagnetic wave shielding layer Grant 5,416,667 - Ichikawa , et al. May 16, 1	1995-05-16
Method of manufacturing multilayer printed wiring board Grant 5,404,637 - Kawakami April 11, 1	1995-04-11
Printed wiring board having shielding layer Grant 5,294,755 - Kawakami , et al. March 15, 1	1994-03-15
Printed circuit board having an electromagnetic shielding layer Grant 5,293,004 - Kawakami , et al. March 8, 1	1994-03-08
Method of packing filler into through-holes in a printed circuit board Grant 5,268,194 - Kawakami , et al. * December 7, 1	1993-12-07
Printed wiring board having through-holes covered with ink layer and method of manufacture thereof Grant 5,266,748 - Kawakami , et al. November 30, 1	1993-11-30
Printed wiring board shielded from electromagnetic wave Grant 5,262,596 - Kawakami , et al. November 16, 1	1993-11-16
Printed wiring board having a connecting terminal Grant 5,250,757 - Kawakami , et al. October 5, 1	1993-10-05
Method of producing a printed circuit board Grant 5,210,940 - Kawakami , et al. May 18, 1	1993-05-18
Etching method of forming microcircuit patterns on a printed circuit board Grant 5,180,465 - Seki , et al. January 19, 1	1993-01-19
Apparatus for packing filler into through-holes or the like in a printed circuit board Grant 5,145,691 - Kawakami , et al. September 8, 1	1992-09-08
Method of filling conductive material into through holes of printed wiring board Grant 5,133,120 - Kawakami , et al. July 28, 1	1992-07-28
Method of manufacturing a printed circuit board Grant 5,100,695 - Kawakami , et al. March 31, 1	1992-03-31
Printed wiring board with an electronic wave shielding layer Grant 5,030,800 - Kawakami , et al. July 9, 1	1991-07-09
Printed circuit board with filled throughholes Grant 5,028,743 - Kawakami , et al. July 2, 1	1991-07-02
Printed circuit board having conductors interconnected by foamed electroconductive paste Grant 4,991,060 - Kawakami , et al. February 5, 1	1991-02-05
Printed circuit board Grant 4,885,431 - Kawakami , et al. December 5, 1	1989-12-05

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