Kawakami; Norihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawakami; Norihiro.The latest application filed is for "hollow stabilizer, stabilizer manufacturing device, and method for manufacturing hollow stabilizer".
- Kawakami; Norihiro - Yokohama JP
- KAWAKAMI; Norihiro - Yokohama-shi JP
- Kawakami; Norihiro - Oita-Ken JP
- Kawakami; Norihiro - Beppu JP
- KAWAKAMI; NORIHIRO - Oita JP
- Kawakami; Norihiro - Beppu-shi JP
| Patent | Date |
|---|---|
| Hollow stabilizer, stabilizer manufacturing device, and method for manufacturing hollow stabilizer Grant 11,167,615 - Kawakami , et al. November 9, 2 | 2021-11-09 |
| Hollow Stabilizer, Stabilizer Manufacturing Device, And Method For Manufacturing Hollow Stabilizer App 20210316589 - KAWAKAMI; Norihiro ; et al. | 2021-10-14 |
| Hollow Stabilizer, Stabilizer Manufacturing Device, And Method For Manufacturing Hollow Stabilizer App 20200023707 - KAWAKAMI; Norihiro ; et al. | 2020-01-23 |
| Spot heat wirebonding Grant 7,926,698 - Kawakami , et al. April 19, 2 | 2011-04-19 |
| Spot Heat Wirebonding App 20100140327 - KAWAKAMI; Norihiro ; et al. | 2010-06-10 |
| Spot heat wirebonding Grant 7,677,432 - Kawakami , et al. March 16, 2 | 2010-03-16 |
| Method Of Forming A Probe Pad Layout/design, And Related Device App 20090189299 - Miranda; Ariel L. ; et al. | 2009-07-30 |
| Wire Bonds Having Pressure-Absorbing Balls App 20080251918 - KADOGUCHI; SOHICHI ; et al. | 2008-10-16 |
| Wire bonds having pressure-absorbing balls Grant 7,404,513 - Kadoguchi , et al. July 29, 2 | 2008-07-29 |
| Spot heat wirebonding App 20060249561 - Kawakami; Norihiro ; et al. | 2006-11-09 |
| Wire bonds having pressure-absorbing balls App 20060144907 - Kadoguchi; Sohichi ; et al. | 2006-07-06 |
| Method and system for improved wire bonding App 20050275073 - Kawakami, Norihiro ; et al. | 2005-12-15 |
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