Kawakami; Naohisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawakami; Naohisa.The latest application filed is for "sliding bearing".
- Kawakami; Naohisa - Aichi JP
- Kawakami; Naohisa - Inuyama JP
- Kawakami; Naohisa - Nagoya JP
- Kawakami, Naohisa - Nogoya JP
| Patent | Date |
|---|---|
| Slide bearing Grant 8,888,370 - Kobayakawa , et al. November 18, 2 | 2014-11-18 |
| Sliding Bearing App 20140233875 - Kobayakawa; Hiroki ; et al. | 2014-08-21 |
| Slide Bearing App 20140037236 - KOBAYAKAWA; Hiroki ; et al. | 2014-02-06 |
| Aluminum-based Bearing Alloy App 20090246072 - NIRASAWA; Tomoyuki ; et al. | 2009-10-01 |
| Sliding member Grant 7,431,507 - Tsuji , et al. October 7, 2 | 2008-10-07 |
| Plain bearing App 20070082825 - Kawakami; Naohisa ; et al. | 2007-04-12 |
| Sliding member Grant 7,153,591 - Tsuji , et al. December 26, 2 | 2006-12-26 |
| Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same Grant 6,905,779 - Sakai , et al. June 14, 2 | 2005-06-14 |
| Sliding member App 20040264820 - Tsuji, Hideo ; et al. | 2004-12-30 |
| Sliding member App 20040265618 - Tsuji, Hideo ; et al. | 2004-12-30 |
| Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same App 20040161625 - Sakai, Kenji ; et al. | 2004-08-19 |
| Copper-based sliding material, method of manufacturing the same, and sliding bearing Grant 6,692,548 - Sakai , et al. February 17, 2 | 2004-02-17 |
| Copper alloy sliding material Grant 6,652,675 - Sakai , et al. November 25, 2 | 2003-11-25 |
| Sliding member Grant 6,378,670 - Kawakami , et al. April 30, 2 | 2002-04-30 |
| Copper-based sliding material, method of manufacturing the same, and sliding bearing App 20020026855 - Sakai, Kenji ; et al. | 2002-03-07 |
| Copper alloy sliding material Grant 6,334,914 - Sakai , et al. January 1, 2 | 2002-01-01 |
| Copper alloy sliding material App 20010021353 - Sakai, Kenji ; et al. | 2001-09-13 |
| Copper alloy sliding material App 20010019779 - Sakai, Kenji ; et al. | 2001-09-06 |
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