Kawakami; Hiromichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawakami; Hiromichi.The latest application filed is for "multilayer ceramic substrate".

Company Profile

5.11.16

Kawakami; Hiromichi - Kyoto JP
Kawakami; Hiromichi - Nagaokakyo JP
Kawakami; Hiromichi - Nagaokakyo-shi JP
KAWAKAMI; Hiromichi - Echizen-shi JP
Kawakami; Hiromichi - Moriyama JP
Kawakami; Hiromichi - Moriyama-shi JP
Kawakami, Hiromichi - Moriyama-shi Shiga-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer circuit board used for probe card and probe card including multilayer circuit board Grant 11,067,600 - Takemura , et al. July 20, 2	2021-07-20
Multilayer ceramic substrate Grant 10,638,603 - Oka , et al.	2020-04-28
Multilayer Ceramic Substrate App 20200045811 - Oka; Takahiro ; et al.	2020-02-06
Composite substrate and method for manufacturing composite substrate Grant 10,499,506 - Hanao , et al. De	2019-12-03
Multilayer ceramic substrate Grant 10,485,099 - Oka , et al. Nov	2019-11-19
Electronic Device And Multilayer Ceramic Substrate App 20190191565 - Oka; Takahiro ; et al.	2019-06-20
Multilayer Ceramic Substrate App 20190069396 - Oka; Takahiro ; et al.	2019-02-28
Composite Substrate And Method For Manufacturing Composite Substrate App 20180376594 - Hanao; Masaaki ; et al.	2018-12-27
Multilayer Circuit Board Used For Probe Card And Probe Card Including Multilayer Circuit Board App 20180364280 - Takemura; Tadaji ; et al.	2018-12-20
Low temperature co-fired ceramic material, low temperature co-fired ceramic body, and multilayer ceramic substrate Grant 8,231,961 - Yokoyama , et al. July 31, 2	2012-07-31
Low Temperature Co-fired Ceramic Material, Low Temperature Co-fired Ceramic Body, And Multilayer Ceramic Substrate App 20110091686 - Yokoyama; Tomoya ; et al.	2011-04-21
Ceramic Multilayer Substrate And Its Manufacturing Method App 20090321121 - KAWAKAMI; Hiromichi ; et al.	2009-12-31
Method of producing ceramic multilayer substrates, and green composite laminate Grant 7,569,177 - Saitoh , et al. August 4, 2	2009-08-04
Ceramic Multilayer Substrate And Its Manufacturing Method App 20070256859 - KAWAKAMI; Hiromichi ; et al.	2007-11-08
Method of producing ceramic multilayer substrates, and green composite laminate App 20060061019 - Saitoh; Yoshifumi ; et al.	2006-03-23
Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body Grant 7,001,569 - Saitoh , et al. February 21, 2	2006-02-21
Ceramic multilayer substrate manufacturing method and unfired composite multilayer body Grant 6,942,833 - Kawakami , et al. September 13, 2	2005-09-13
Method for manufacturing multilayer ceramic substrates Grant 6,938,332 - Harada , et al. September 6, 2	2005-09-06
Ceramic multilayer substrate manufacturing method and unfired composite multilayer body App 20050008824 - Kawakami, Hiromichi ; et al.	2005-01-13
Photosensitive insulating paste and thick film multi-layer circuit substrate Grant 6,602,946 - Tose , et al. August 5, 2	2003-08-05
Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body App 20030008182 - Saitoh, Yoshifumi ; et al.	2003-01-09
Method for manufacturing multilayer ceramic substrates App 20030000079 - Harada, Hideyuki ; et al.	2003-01-02
Multilayer board and method for making the same App 20020034614 - Kawakami, Hiromichi ; et al.	2002-03-21
Photosensitive insulating paste and thick film multi-layer circuit substrate App 20020035194 - Tose, Makoto ; et al.	2002-03-21
Multilayered board and method for fabricating the same App 20020029838 - Kawakami, Hiromichi	2002-03-14
Composite monolithic electronic component App 20020027282 - Kawakami, Hiromichi ; et al.	2002-03-07
Dielectric ceramic composition and ceramic electronic element produced from the same Grant 6,316,374 - Kawakami November 13, 2	2001-11-13

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