Kawajiri; Tetsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawajiri; Tetsuya.The latest application filed is for "joined body including ceramic member and metallic member and method for manufacturing joined body".

Company Profile

0.15.17

Kawajiri; Tetsuya - Handa JP
KAWAJIRI; Tetsuya - Handa-City JP
Kawajiri; Tetsuya - Handa-Shi JP
Kawajiri; Tetsuya - Nagoya JP
Kawajiri, Tetsuya - Nagoya-shi JP
Kawajiri; Tetsuya - Ichinomiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Member for semiconductor manufacturing apparatuses Grant 11,456,189 - Ohba , et al. September 27, 2	2022-09-27
Joined body including ceramic member and metallic member and method for manufacturing joined body Grant 10,814,436 - Minami , et al. October 27, 2	2020-10-27
Joined body manufacturing method and joined body Grant 10,332,771 - Minami , et al.	2019-06-25
Joined body manufacturing method Grant 10,150,709 - Minami , et al. Dec	2018-12-11
Wafer holder and method for manufacturing the same Grant 10,037,910 - Yanoh , et al. July 31, 2	2018-07-31
Joined Body Including Ceramic Member And Metallic Member And Method For Manufacturing Joined Body App 20170036961 - MINAMI; Tomoyuki ; et al.	2017-02-09
Joined Body Manufacturing Method App 20160368829 - MINAMI; Tomoyuki ; et al.	2016-12-22
Joined Body Manufacturing Method And Joined Body App 20160358801 - MINAMI; Tomoyuki ; et al.	2016-12-08
Wafer Holder And Method For Manufacturing The Same App 20160196999 - YANOH; Takuya ; et al.	2016-07-07
Bonded body of ceramic member and metal member and method for manufacturing the same Grant 9,126,384 - Minami , et al. September 8, 2	2015-09-08
Member For Semiconductor Manufacturing Apparatuses App 20140272421 - OHBA; Kazuma ; et al.	2014-09-18
Bonded Body Of Ceramic Member And Metal Member And Method For Manufacturing The Same App 20140127484 - MINAMI; Tomoyuki ; et al.	2014-05-08
Electrostatic chuck with heater and manufacturing method thereof Grant 8,136,820 - Morioka , et al. March 20, 2	2012-03-20
Substrate supporting member Grant 8,129,016 - Kawajiri , et al. March 6, 2	2012-03-06
Electrostatic chuck with heater Grant 7,848,075 - Nobori , et al. December 7, 2	2010-12-07
Electrostatic Chuck With Heater App 20080266745 - Nobori; Kazuhiro ; et al.	2008-10-30
Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same Grant 7,416,793 - Matsuda , et al. August 26, 2	2008-08-26
Electrostatic Chuck And Method Of Manufacturing The Same App 20080186647 - KAWAJIRI; Tetsuya ; et al.	2008-08-07
Substrate Supporting Member App 20080138645 - KAWAJIRI; Tetsuya ; et al.	2008-06-12
Method of fabricating substrate placing stage Grant 7,353,979 - Fujii , et al. April 8, 2	2008-04-08
Electrostatic Chuck With Heater And Manufacturing Method Thereof App 20080049374 - Morioka; Ikuhisa ; et al.	2008-02-28
Electrostatic Chuck App 20070146961 - Morioka; Ikuhisa ; et al.	2007-06-28
Electrostatic chuck and method of manufacturing electrostatic chuck App 20060213900 - Matsuda; Hiroto ; et al.	2006-09-28
Joined bodies and a method of producing the same Grant 7,067,200 - Fujii , et al. June 27, 2	2006-06-27
Substrate mounting apparatus and control method of substrate temperature App 20060021705 - Imai; Yasuyoshi ; et al.	2006-02-02
Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same App 20050152089 - Matsuda, Hiroto ; et al.	2005-07-14
Method of fabricating substrate placing stage App 20050118450 - Fujii, Tomoyuki ; et al.	2005-06-02
Electrostatic adsorption device Grant 6,728,091 - Tsuruta , et al. April 27, 2	2004-04-27
Joined bodies and a method of producing the same App 20040016792 - Fujii, Tomoyuki ; et al.	2004-01-29
Electrostatic adsorption device App 20030059627 - Tsuruta, Hideyoshi ; et al.	2003-03-27
Plasma processing apparatus Grant 6,432,208 - Kawakami , et al. August 13, 2	2002-08-13
Equipment for holding a semiconductor wafer, a method for manufacturing the same, and a method for using the same Grant 6,292,346 - Ohno , et al. September 18, 2	2001-09-18

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