Kawai; Toshiyasu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawai; Toshiyasu.The latest application filed is for "thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device".

Company Profile

0.8.7

Kawai; Toshiyasu - Chiba JP
Kawai; Toshiyasu - Chiba-shi JP
Kawai; Toshiyasu - Ichihara JP
KAWAI; Toshiyasu - Ichihara-shi JP
Kawai; Toshiyasu - Inage-ku Konakadai JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device Grant 7,843,045 - Tateoka , et al. November 30, 2	2010-11-30
Thermoplastic Resin Composition For Semiconductor, Adhesion Film, Lead Frame, And Semiconductor Device Using The Same, And Method Of Producing Semiconductor Device App 20090091012 - Tateoka; Kiyohide ; et al.	2009-04-09
Adhesive Film For Semiconductor Use, Metal Sheet Laminated With Adhesive Film, Wiring Circuit Laminated With Adhesive Film, And Semiconductor Device Using Same, And Method For Producing Semiconductor Device App 20090053498 - MATSUURA; Hidekazu ; et al.	2009-02-26
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,479,412 - Kawai , et al. January 20, 2	2009-01-20
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Grant 7,449,367 - Matsuura , et al. November 11, 2	2008-11-11
Adhesive Film For Semiconductor, Lead Frame And Semiconductor Device Using The Same, And Method Of Producing Semiconductor Device App 20080194062 - KAWAI; Toshiyasu ; et al.	2008-08-14
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,378,722 - Kawai , et al. May 27, 2	2008-05-27
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device App 20060138616 - Kawai; Toshiyasu ; et al.	2006-06-29
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Grant 7,057,266 - Kawai , et al. June 6, 2	2006-06-06
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufactring semiconductor device App 20060043607 - Matsuura; Hidekazu ; et al.	2006-03-02
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device App 20040124544 - Kawai, Toshiyasu ; et al.	2004-07-01
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device Grant 6,700,185 - Kawai , et al. March 2, 2	2004-03-02
Resin Composition And Adhesive Film App 20020151659 - SUZUKI, MASAHIRO ; et al.	2002-10-17
Adhesive film of quinoline polymer and bismaleimide Grant 6,462,148 - Suzuki , et al. October 8, 2	2002-10-08
Plastic lens Grant 5,583,191 - Kawai , et al. December 10, 1	1996-12-10

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