Kawahashi; Nobuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawahashi; Nobuo.The latest application filed is for "chemical mechanical polishing agent kit and chemical mechanical polishing method using the same".

Company Profile

0.27.43

Kawahashi; Nobuo - Chuo-ku JP
Kawahashi; Nobuo - Tokyo JP
Kawahashi; Nobuo - Yokohama JP
Kawahashi; Nobuo - Yokohama-shi JP
Kawahashi; Nobuo - Yokkaichi JP
Kawahashi; Nobuo - Mie JP
Kawahashi, Nobuo - Tsukiji Chuo-ku
Kawahashi, Nobuo - Yokkaichi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 7,550,020 - Ikeda , et al. June 23, 2	2009-06-23
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device Grant 7,498,294 - Konno , et al. March 3, 2	2009-03-03
Chemical Mechanical Polishing Agent Kit And Chemical Mechanical Polishing Method Using The Same App 20080274620 - SHIDA; Hirotaka ; et al.	2008-11-06
Chemical mechanical polishing pad Grant 7,442,116 - Miyauchi , et al. October 28, 2	2008-10-28
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 7,378,349 - Konno , et al. May 27, 2	2008-05-27
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer Grant 7,323,415 - Shiho , et al. January 29, 2	2008-01-29
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 7,252,782 - Ikeda , et al. August 7, 2	2007-08-07
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing Grant 7,183,211 - Konno , et al. February 27, 2	2007-02-27
Chemical mechanical polishing pad and chemical mechanical polishing method Grant 7,183,213 - Shiho , et al. February 27, 2	2007-02-27
Chemical/mechanical polishing method for STI Grant 7,163,448 - Hattori , et al. January 16, 2	2007-01-16
Method of chemical mechanical polishing Grant 7,153,369 - Motonari , et al. December 26, 2	2006-12-26
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion App 20060276041 - Uchikura; Kazuhito ; et al.	2006-12-07
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion App 20060201914 - Uchikura; Kazuhito ; et al.	2006-09-14
Aqueous dispersion for chemical/mechanical polishing Grant 7,090,786 - Hattori , et al. August 15, 2	2006-08-15
Aqueous dispersion for chemical mechanical polishing Grant 7,087,530 - Motonari , et al. August 8, 2	2006-08-08
Composition for polishing pad and polishing pad using the same Grant 7,077,879 - Ogawa , et al. July 18, 2	2006-07-18
Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer App 20060128271 - Shiho; Hiroshi ; et al.	2006-06-15
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing Grant 7,005,382 - Nishimoto , et al. February 28, 2	2006-02-28
Polishing pad Grant 6,992,123 - Shiho , et al. January 31, 2	2006-01-31
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method App 20060010781 - Ikeda; Norihiko ; et al.	2006-01-19
Cleaning composition for semiconductor components and process for manufacturing semiconductor device App 20050284844 - Hattori, Masayuki ; et al.	2005-12-29
Polishing pad Grant 6,976,910 - Hosaka , et al. December 20, 2	2005-12-20
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers App 20050245171 - Hosaka, Yukio ; et al.	2005-11-03
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method App 20050239380 - Hosaka, Yukio ; et al.	2005-10-27
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method App 20050227451 - Konno, Tomohisa ; et al.	2005-10-13
Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process App 20050222336 - Okamoto, Takahiro ; et al.	2005-10-06
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 6,935,928 - Uchikura , et al. August 30, 2	2005-08-30
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device App 20050176606 - Konno, Tomohisa ; et al.	2005-08-11
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device Grant 6,924,227 - Minamihaba , et al. August 2, 2	2005-08-02
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method App 20050164510 - Ikeda, Norihiko ; et al.	2005-07-28
Chemical mechanical polishing pad App 20050113011 - Miyauchi, Hiroyuki ; et al.	2005-05-26
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method App 20050037693 - Uchikura, Kazuhito ; et al.	2005-02-17
Chemical mechanical polishing pad and chemical mechanical polishing method App 20050014376 - Shiho, Hiroshi ; et al.	2005-01-20
Aqueous dispersion for chemical/mechanical polishing App 20050001199 - Hattori, Masayuki ; et al.	2005-01-06
Polishing pad App 20050003749 - Hosaka, Yukio ; et al.	2005-01-06
Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad App 20040266326 - Shiho, Hiroshi ; et al.	2004-12-30
Window member for chemical mechanical polishing and polishing pad Grant 6,832,949 - Konno , et al. December 21, 2	2004-12-21
Composition for polishing pad and polishing pad using the same App 20040244299 - Ogawa, Toshihiro ; et al.	2004-12-09
Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same App 20040237413 - Shida, Hirotaka ; et al.	2004-12-02
Chemical/mechanical polishing method for STI App 20040235396 - Hattori, Masayuki ; et al.	2004-11-25
Polishing pad and chemical mechanical polishing method App 20040224616 - Shiho, Hiroshi ; et al.	2004-11-11
Polishing pad and method of polishing a semiconductor wafer App 20040224611 - Aoi, Hiromi ; et al.	2004-11-11
Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method App 20040203320 - Hosaka, Yukio ; et al.	2004-10-14
Composition for polishing pad and polishing pad using the same Grant 6,790,883 - Ogawa , et al. September 14, 2	2004-09-14
Aqueous dispersion for chemical mechanical polishing Grant 6,786,944 - Hattori , et al. September 7, 2	2004-09-07
Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device App 20040162011 - Konno, Tomohisa ; et al.	2004-08-19
Aqueous dispersion for chemical mechanical polishing App 20040144755 - Motonari, Masayuki ; et al.	2004-07-29
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing App 20040132305 - Nishimoto, Kazuo ; et al.	2004-07-08
Polishing pad App 20040118051 - Shiho, Hiroshi ; et al.	2004-06-24
Composition for washing a polishing pad and method for washing a polishing pad Grant 6,740,629 - Ando , et al. May 25, 2	2004-05-25
Composition for polishing pad and polishing pad therewith App 20040063391 - Hosaka, Yukio ; et al.	2004-04-01
Polishing pad and multi-layer polishing pad App 20040014413 - Kawahashi, Nobuo ; et al.	2004-01-22
Aqueous dispersion for chemical mechanical polishing used for polishing of copper Grant 6,653,267 - Yano , et al. November 25, 2	2003-11-25
Aqueous dispersion for chemical mechanical polishing App 20030196386 - Hattori, Masayuki ; et al.	2003-10-23
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing App 20030153183 - Konno, Tomohisa ; et al.	2003-08-14
Window member for chemical mechanical polishing and polishing pad App 20030129931 - Konno, Tomohisa ; et al.	2003-07-10
Aqueous dispersion for chemical mechanical polishing Grant 6,559,056 - Hattori , et al. May 6, 2	2003-05-06
Aqueous dispersion for chemical mechanical polishing Grant 6,527,818 - Hattori , et al. March 4, 2	2003-03-04
Composition for washing a polishing pad and method for washing a polishing pad App 20030004085 - Ando, Michiaki ; et al.	2003-01-02
Method of chemical mechanical polishing App 20020193451 - Motonari, Masayuki ; et al.	2002-12-19
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device App 20020023389 - Minamihaba, Gaku ; et al.	2002-02-28
Aqueous dispersion for chemical mechanical polishing used for polishing of copper App 20020016275 - Yano, Hiroyuki ; et al.	2002-02-07
Aqueous dispersion for chemical mechanical polishing App 20020011031 - Hattori, Masayuki ; et al.	2002-01-31
Composition for polishing pad and polishing pad using the same App 20020010232 - Ogawa, Toshihiro ; et al.	2002-01-24
Aqueous dispersion for chemical mechanical polishing App 20020005017 - Motonari, Masayuki ; et al.	2002-01-17
Aqueous dispersion for chemical mechanical polishing App 20010049912 - Motonari, Masayuki ; et al.	2001-12-13
Aqueous dispersion for chemical mechanical polishing App 20010039766 - Hattori, Masayuki ; et al.	2001-11-15
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process App 20010008828 - Uchikura, Kazuhito ; et al.	2001-07-19
Process for producing a polyorganosiloxane-based thermoplastic resin Grant 5,773,532 - Okaniwa , et al. June 30, 1	1998-06-30
Coated particles, hollow particles, and process for manufacturing the same Grant 5,318,797 - Matijevic , et al. June 7, 1	1994-06-07

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