loadpatents
Patent applications and USPTO patent grants for Kawahara; Hironobu.The latest application filed is for "plasma processing apparatus and method".
Patent | Date |
---|---|
Plasma processing apparatus and method Grant 7,608,162 - Ohmoto , et al. October 27, 2 | 2009-10-27 |
Specimen surface processing apparatus and surface processing method Grant 7,354,525 - Oyama , et al. April 8, 2 | 2008-04-08 |
Plasma Processing Apparatus And Method App 20080023145 - Ohmoto; Yutaka ;   et al. | 2008-01-31 |
Plasma processing apparatus Grant 7,288,166 - Ohmoto , et al. October 30, 2 | 2007-10-30 |
Method and apparatus for processing samples App 20070037292 - Kojima; Masayuki ;   et al. | 2007-02-15 |
Method and apparatus for processing samples Grant 7,132,293 - Torii , et al. November 7, 2 | 2006-11-07 |
Method and apparatus for processing samples Grant 6,989,228 - Kojima , et al. January 24, 2 | 2006-01-24 |
Specimen surface processing apparatus and surface processing method App 20060000804 - Oyama; Masatoshi ;   et al. | 2006-01-05 |
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield Grant 6,867,144 - Ohmoto , et al. March 15, 2 | 2005-03-15 |
Method and apparatus for processing samples App 20040219687 - Torii, Yoshimi ;   et al. | 2004-11-04 |
Specimen surface processing apparatus and surface processing method App 20040171273 - Oyama, Masatoshi ;   et al. | 2004-09-02 |
Plasma processing apparatus App 20040149385 - Ohmoto, Yutaka ;   et al. | 2004-08-05 |
Plasma processing apparatus and method Grant 6,759,338 - Ohmoto , et al. July 6, 2 | 2004-07-06 |
Plasma processing apparatus Grant 6,755,935 - Kazumi , et al. June 29, 2 | 2004-06-29 |
Wafer processing apparatus and a wafer stage and a wafer processing method App 20040040933 - Kanno, Seiichiro ;   et al. | 2004-03-04 |
Wafer processing apparatus and a wafer stage and a wafer processing method Grant 6,677,167 - Kanno , et al. January 13, 2 | 2004-01-13 |
Apparatus for processing samples Grant 6,656,846 - Kojima , et al. December 2, 2 | 2003-12-02 |
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield Grant 6,649,021 - Ohmoto , et al. November 18, 2 | 2003-11-18 |
Plasma processing equipment and plasma processing method using the same Grant 6,624,084 - Maeda , et al. September 23, 2 | 2003-09-23 |
Wafer processing apparatus and a wafer stage and a wafer processing method App 20030164226 - Kanno, Seiichiro ;   et al. | 2003-09-04 |
Apparatus for processing samples Grant 6,537,415 - Kojima , et al. March 25, 2 | 2003-03-25 |
Semiconductor Wafer Processing Apparatus And Method App 20030030960 - Kanno, Seiichiro ;   et al. | 2003-02-13 |
Semiconductor wafer processing apparatus and method App 20030029572 - Kanno, Seiichiro ;   et al. | 2003-02-13 |
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield App 20020127858 - Ohmoto, Yutaka ;   et al. | 2002-09-12 |
Plasma processing device and plasma processing method Grant 6,427,621 - Ikegawa , et al. August 6, 2 | 2002-08-06 |
Vacuum processing apparatus and a vacuum processing system App 20020081175 - Kawahara, Hironobu ;   et al. | 2002-06-27 |
Vacuum processing apparatus and a vacuum processing system App 20020081174 - Kawahara, Hironobu ;   et al. | 2002-06-27 |
Apparatus for processing samples App 20020043340 - Kojima, Masayuki ;   et al. | 2002-04-18 |
Apparatus for processing samples App 20020043339 - Kojima, Masayuki ;   et al. | 2002-04-18 |
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield App 20020025686 - Ohmoto, Yutaka ;   et al. | 2002-02-28 |
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield App 20020023716 - Ohmoto, Yutaka ;   et al. | 2002-02-28 |
Apparatus for processing samples App 20020023720 - Kojima, Masayuki ;   et al. | 2002-02-28 |
Method and apparatus for processing samples App 20020013063 - Kojima, Masayuki ;   et al. | 2002-01-31 |
Plasma processing apparatus App 20010023663 - Kazumi, Hideyuki ;   et al. | 2001-09-27 |
Plasma processing equipment and plasma processing method using the same App 20010022293 - Maeda, Kenji ;   et al. | 2001-09-20 |
Plasma processing apparatus and method App 20010019881 - Ohmoto, Yutaka ;   et al. | 2001-09-06 |
Vacuum treatment system and its stage Grant 6,235,146 - Kadotani , et al. May 22, 2 | 2001-05-22 |
Plasma etching method and apparatus Grant 5,900,162 - Kawahara , et al. May 4, 1 | 1999-05-04 |
Method and apparatus for processing samples Grant 5,868,854 - Kojima , et al. February 9, 1 | 1999-02-09 |
Microwave plasma processing apparatus and method Grant 5,861,601 - Sato , et al. January 19, 1 | 1999-01-19 |
Method of treating samples Grant 5,770,100 - Fukuyama , et al. June 23, 1 | 1998-06-23 |
Method of treating samples Grant 5,556,714 - Fukuyama , et al. September 17, 1 | 1996-09-17 |
Method of treating samples Grant 5,380,397 - Fukuyama , et al. January 10, 1 | 1995-01-10 |
Sample processing method and apparatus Grant 5,200,017 - Kawasaki , et al. April 6, 1 | 1993-04-06 |
Process for etching Grant 5,110,408 - Fujii , et al. May 5, 1 | 1992-05-05 |
Method of removing residual corrosive compounds by plasma etching followed by washing Grant 5,007,981 - Kawasaki , et al. April 16, 1 | 1991-04-16 |
Plasma treating method and apparatus therefor Grant 4,795,529 - Kawasaki , et al. January 3, 1 | 1989-01-03 |
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