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name:-0.34665703773499
name:-0.0026979446411133
Kawahara; Hironobu Patent Filings

Kawahara; Hironobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kawahara; Hironobu.The latest application filed is for "plasma processing apparatus and method".

Company Profile
0.25.22
  • Kawahara; Hironobu - Kudamatsu JP
  • Kawahara; Hironobu - Kudamatsu-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Plasma processing apparatus and method
Grant 7,608,162 - Ohmoto , et al. October 27, 2
2009-10-27
Specimen surface processing apparatus and surface processing method
Grant 7,354,525 - Oyama , et al. April 8, 2
2008-04-08
Plasma Processing Apparatus And Method
App 20080023145 - Ohmoto; Yutaka ;   et al.
2008-01-31
Plasma processing apparatus
Grant 7,288,166 - Ohmoto , et al. October 30, 2
2007-10-30
Method and apparatus for processing samples
App 20070037292 - Kojima; Masayuki ;   et al.
2007-02-15
Method and apparatus for processing samples
Grant 7,132,293 - Torii , et al. November 7, 2
2006-11-07
Method and apparatus for processing samples
Grant 6,989,228 - Kojima , et al. January 24, 2
2006-01-24
Specimen surface processing apparatus and surface processing method
App 20060000804 - Oyama; Masatoshi ;   et al.
2006-01-05
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
Grant 6,867,144 - Ohmoto , et al. March 15, 2
2005-03-15
Method and apparatus for processing samples
App 20040219687 - Torii, Yoshimi ;   et al.
2004-11-04
Specimen surface processing apparatus and surface processing method
App 20040171273 - Oyama, Masatoshi ;   et al.
2004-09-02
Plasma processing apparatus
App 20040149385 - Ohmoto, Yutaka ;   et al.
2004-08-05
Plasma processing apparatus and method
Grant 6,759,338 - Ohmoto , et al. July 6, 2
2004-07-06
Plasma processing apparatus
Grant 6,755,935 - Kazumi , et al. June 29, 2
2004-06-29
Wafer processing apparatus and a wafer stage and a wafer processing method
App 20040040933 - Kanno, Seiichiro ;   et al.
2004-03-04
Wafer processing apparatus and a wafer stage and a wafer processing method
Grant 6,677,167 - Kanno , et al. January 13, 2
2004-01-13
Apparatus for processing samples
Grant 6,656,846 - Kojima , et al. December 2, 2
2003-12-02
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
Grant 6,649,021 - Ohmoto , et al. November 18, 2
2003-11-18
Plasma processing equipment and plasma processing method using the same
Grant 6,624,084 - Maeda , et al. September 23, 2
2003-09-23
Wafer processing apparatus and a wafer stage and a wafer processing method
App 20030164226 - Kanno, Seiichiro ;   et al.
2003-09-04
Apparatus for processing samples
Grant 6,537,415 - Kojima , et al. March 25, 2
2003-03-25
Semiconductor Wafer Processing Apparatus And Method
App 20030030960 - Kanno, Seiichiro ;   et al.
2003-02-13
Semiconductor wafer processing apparatus and method
App 20030029572 - Kanno, Seiichiro ;   et al.
2003-02-13
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
App 20020127858 - Ohmoto, Yutaka ;   et al.
2002-09-12
Plasma processing device and plasma processing method
Grant 6,427,621 - Ikegawa , et al. August 6, 2
2002-08-06
Vacuum processing apparatus and a vacuum processing system
App 20020081175 - Kawahara, Hironobu ;   et al.
2002-06-27
Vacuum processing apparatus and a vacuum processing system
App 20020081174 - Kawahara, Hironobu ;   et al.
2002-06-27
Apparatus for processing samples
App 20020043340 - Kojima, Masayuki ;   et al.
2002-04-18
Apparatus for processing samples
App 20020043339 - Kojima, Masayuki ;   et al.
2002-04-18
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
App 20020025686 - Ohmoto, Yutaka ;   et al.
2002-02-28
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
App 20020023716 - Ohmoto, Yutaka ;   et al.
2002-02-28
Apparatus for processing samples
App 20020023720 - Kojima, Masayuki ;   et al.
2002-02-28
Method and apparatus for processing samples
App 20020013063 - Kojima, Masayuki ;   et al.
2002-01-31
Plasma processing apparatus
App 20010023663 - Kazumi, Hideyuki ;   et al.
2001-09-27
Plasma processing equipment and plasma processing method using the same
App 20010022293 - Maeda, Kenji ;   et al.
2001-09-20
Plasma processing apparatus and method
App 20010019881 - Ohmoto, Yutaka ;   et al.
2001-09-06
Vacuum treatment system and its stage
Grant 6,235,146 - Kadotani , et al. May 22, 2
2001-05-22
Plasma etching method and apparatus
Grant 5,900,162 - Kawahara , et al. May 4, 1
1999-05-04
Method and apparatus for processing samples
Grant 5,868,854 - Kojima , et al. February 9, 1
1999-02-09
Microwave plasma processing apparatus and method
Grant 5,861,601 - Sato , et al. January 19, 1
1999-01-19
Method of treating samples
Grant 5,770,100 - Fukuyama , et al. June 23, 1
1998-06-23
Method of treating samples
Grant 5,556,714 - Fukuyama , et al. September 17, 1
1996-09-17
Method of treating samples
Grant 5,380,397 - Fukuyama , et al. January 10, 1
1995-01-10
Sample processing method and apparatus
Grant 5,200,017 - Kawasaki , et al. April 6, 1
1993-04-06
Process for etching
Grant 5,110,408 - Fujii , et al. May 5, 1
1992-05-05
Method of removing residual corrosive compounds by plasma etching followed by washing
Grant 5,007,981 - Kawasaki , et al. April 16, 1
1991-04-16
Plasma treating method and apparatus therefor
Grant 4,795,529 - Kawasaki , et al. January 3, 1
1989-01-03

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