Kawada; Daisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawada; Daisuke.The latest application filed is for "substrate processing apparatus".
- Kawada; Daisuke - Shizuoka JP
- KAWADA; Daisuke - Miyagi JP
- Kawada; Daisuke - Tokyo JP
| Patent | Date |
|---|---|
| Electrical connection box and wire harness Grant 10,879,682 - Kawada , et al. December 29, 2 | 2020-12-29 |
| Substrate Processing Apparatus App 20200267826 - KAWADA; Daisuke ; et al. | 2020-08-20 |
| Clearance filling structure of accommodation box, electric connection box, and wire harness Grant 10,333,287 - Nakashima , et al. | 2019-06-25 |
| Electrical connection box and wire harness Grant 10,305,267 - Kawada , et al. | 2019-05-28 |
| Clearance Filling Structure Of Accommodation Box, Electric Connection Box, And Wire Harness App 20190123537 - NAKASHIMA; Akinori ; et al. | 2019-04-25 |
| Electrical connection box Grant 10,137,561 - Kawada , et al. November 27, 2 | 2018-11-27 |
| Impeller brazing method Grant 9,815,134 - Yokoo , et al. November 14, 2 | 2017-11-14 |
| Impeller Brazing Method App 20170144241 - YOKOO; Kazutoshi ; et al. | 2017-05-25 |
| Electrical Connection Box App 20170066113 - Kawada; Daisuke ; et al. | 2017-03-09 |
| Electrical Connection Box And Wire Harness App 20170070040 - Kawada; Daisuke ; et al. | 2017-03-09 |
| Electrical Connection Box And Wire Harness App 20170063069 - Kawada; Daisuke ; et al. | 2017-03-02 |
| Impeller brazing method Grant 9,566,655 - Yokoo , et al. February 14, 2 | 2017-02-14 |
| Impeller Manufacturing Method App 20130320073 - Yokoo; Kazutoshi ; et al. | 2013-12-05 |
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