KAWABATA; Kiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAWABATA; Kiichi.The latest application filed is for "condensation-curable resin composition, cured product, molded body, and semiconductor device".

Company Profile

0.10.9

KAWABATA; Kiichi - Chiba JP
Kawabata; Kiichi - Kumamoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Condensation-curable Resin Composition, Cured Product, Molded Body, And Semiconductor Device App 20220025123 - IKENO; Hironori ; et al.	2022-01-27
Thermosetting resin composition Grant 9,593,240 - Tajima , et al. March 14, 2	2017-03-14
Thermosetting resin composition Grant 9,512,273 - Tajima , et al. December 6, 2	2016-12-06
Thermosetting Resin Composition App 20160264779 - TAJIMA; AKIO ; et al.	2016-09-15
Thermosetting Resin Composition App 20150291737 - Tajima; Akio ; et al.	2015-10-15
Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor Grant 9,115,243 - Kawabata , et al. August 25, 2	2015-08-25
Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor Grant 8,987,358 - Kawabata , et al. March 24, 2	2015-03-24
New Organosilicon Compound, Thermosetting Resin Composition Containing The Organosilicon Compound, Hardening Resin And Encapsulation Material For Optical Semiconductor App 20150065643 - KAWABATA; KIICHI ; et al.	2015-03-05
Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor Grant 8,952,108 - Inoki , et al. February 10, 2	2015-02-10
Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor Grant 8,946,357 - Kawabata , et al. February 3, 2	2015-02-03
Compound Including Organopolysiloxane Or Silsesquioxane Skeleton Having Isocyanuric Skeleton, Epoxy Group And Sih Group, Thermosetting Resin Composition Containing The Compound As Adhesion-imparting Agent, Hardened Material And Sealing Agent For Optical Semiconductor App 20140148536 - Kawabata; Kiichi ; et al.	2014-05-29
New Organosilicon Compound, Thermosetting Resin Composition Containing The Organosilicon Compound, Hardening Resin And Encapsulation Material For Optical Semiconductor App 20130096249 - Kawabata; Kiichi ; et al.	2013-04-18
Organic Silicon Compound, Thermosetting Composition Containing Said Organic Silicon Compound, And Sealing Material For Optical Semiconductor App 20120149819 - Inoki; Daisuke ; et al.	2012-06-14
Polymerizable terminal group-containing polyorganosiloxane and production process for the same Grant 6,310,169 - Kawabata , et al. October 30, 2	2001-10-30

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.