KAUFMANN; Matthew
Patent Applications and Registrations
Patent applications and USPTO patent grants for KAUFMANN; Matthew.The latest application filed is for "embedded package security tamper mesh".
- KAUFMANN; Matthew - Morgan Hill CA
- Kaufmann; Matthew - Ridgeboro PA
| Patent | Date |
|---|---|
| Embedded Package Security Tamper Mesh App 20150137340 - BUER; Mark ; et al. | 2015-05-21 |
| Low cost and high performance flip chip package Grant 8,957,516 - Pang , et al. February 17, 2 | 2015-02-17 |
| Embedded package security tamper mesh Grant 8,890,298 - Buer , et al. November 18, 2 | 2014-11-18 |
| Low Cost And High Performance Flip Chip Package App 20140217573 - PANG; Mengzhi ; et al. | 2014-08-07 |
| System and method for reducing voltage drops in integrated circuits Grant 8,749,011 - Kaufmann , et al. June 10, 2 | 2014-06-10 |
| Embedded Package Security Tamper Mesh App 20140035136 - BUER; Mark ; et al. | 2014-02-06 |
| Enhanced bump pitch scaling Grant 8,508,054 - Pang , et al. August 13, 2 | 2013-08-13 |
| Embedded package security tamper mesh Grant 8,502,396 - Buer , et al. August 6, 2 | 2013-08-06 |
| Low Cost and High Performance Flip Chip Package App 20130187284 - Pang; Mengzhi ; et al. | 2013-07-25 |
| Enhanced Bump Pitch Scaling App 20120319269 - Pang; Mengzhi ; et al. | 2012-12-20 |
| Integrated Circuit Package Security Fence App 20120256305 - Kaufmann; Matthew ; et al. | 2012-10-11 |
| Information Searching And Retrieval System And Method App 20100153358 - Itkoff; David F. ; et al. | 2010-06-17 |
| Embedded Package Security Tamper Mesh App 20090146270 - BUER; Mark ; et al. | 2009-06-11 |
| System and method for reducing voltage drops in integrated circuits App 20060192297 - Kaufmann; Matthew ; et al. | 2006-08-31 |
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