Kaufman; Vlasta Brusic

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaufman; Vlasta Brusic.The latest application filed is for "chemical mechanical polishing systems and methods for their use".

Company Profile

0.19.9

Kaufman; Vlasta Brusic - Geneva IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical mechanical polishing slurry useful for copper substrates Grant 7,381,648 - Kaufman , et al. June 3, 2	2008-06-03
Chemical mechanical polishing systems and methods for their use Grant 7,354,530 - Wang , et al. April 8, 2	2008-04-08
Chemical mechanical polishing systems and methods for their use App 20050148187 - Wang, Shumin ; et al.	2005-07-07
Method of polishing a multi-layer substrate Grant 6,867,140 - Wang , et al. March 15, 2	2005-03-15
Polishing system with stopping compound and method of its use Grant 6,855,266 - Wang , et al. February 15, 2	2005-02-15
Method of polishing a multi-layer substrate Grant 6,852,632 - Wang , et al. February 8, 2	2005-02-08
Chemical mechanical polishing systems and methods for their use Grant 6,840,971 - Wang , et al. January 11, 2	2005-01-11
Chemical mechanical polishing slurry useful for copper substrates App 20040009671 - Kaufman, Vlasta Brusic ; et al.	2004-01-15
Chemical mechanical polishing slurry useful for copper substrates Grant 6,620,037 - Kaufman , et al. September 16, 2	2003-09-16
Chemical mechanical polishing systems and methods for their use App 20030166337 - Wang, Shumin ; et al.	2003-09-04
Method of polishing a multi-layer substrate App 20030153184 - Wang, Shumin ; et al.	2003-08-14
Chemical mechanical polishing method useful for copper substrates Grant 6,593,239 - Kaufman , et al. July 15, 2	2003-07-15
Chemical mechanical polishing slurry useful for copper substrates Grant 6,569,350 - Kaufman , et al. May 27, 2	2003-05-27
Chemical mechanical polishing slurry useful for copper substrates App 20020168923 - Kaufman, Vlasta Brusic ; et al.	2002-11-14
Chemical mechanical polishing slurry useful for copper substrates App 20020145127 - Kaufman, Vlasta Brusic ; et al.	2002-10-10
Chemical Mechanical Polishing Method Useful For Copper Substrates App 20020033382 - KAUFMAN, VLASTA BRUSIC ; et al.	2002-03-21
Chemical Mechanical Polishing Slurry Useful For Copper Substrates App 20010049910 - KAUFMAN, VLASTA BRUSIC ; et al.	2001-12-13
Chemical mechanical polishing slurry useful for copper/tantalum substrates App 20010041507 - Kaufman, Vlasta Brusic ; et al.	2001-11-15
Method of polishing using multi-oxidizer slurry Grant 6,316,366 - Kaufman , et al. November 13, 2	2001-11-13
Chemical mechanical polishing slurry useful for copper substrates Grant 6,309,560 - Kaufman , et al. October 30, 2	2001-10-30
Chemical mechanical polishing slurry useful for copper/tantalum substrates Grant 6,217,416 - Kaufman , et al. April 17, 2	2001-04-17
Chemical mechanical polishing slurry useful for copper substrates Grant 6,126,853 - Kaufman , et al. October 3, 2	2000-10-03
Chemical mechanical polishing slurry useful for copper/tantalum substrate Grant 6,063,306 - Kaufman , et al. May 16, 2	2000-05-16
Multi-oxidizer precursor for chemical mechanical polishing Grant 6,039,891 - Kaufman , et al. March 21, 2	2000-03-21
Multi-oxidizer slurry for chemical mechanical polishing Grant 6,033,596 - Kaufman , et al. March 7, 2	2000-03-07
Chemical mechanical polishing slurry useful for copper substrates Grant 5,954,997 - Kaufman , et al. September 21, 1	1999-09-21
Chemical mechanical polishing slurry for metal layers and films Grant 5,858,813 - Scherber , et al. January 12, 1	1999-01-12
Multi-oxidizer slurry for chemical mechanical polishing Grant 5,783,489 - Kaufman , et al. July 21, 1	1998-07-21

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