| Patent | Date |
|---|
Method of making a circuit assembly
Grant 5,070,602 - Kaufman , et al. December 10, 1 | 1991-12-10 |
Current sense circuit
Grant 4,945,445 - Schmerda , et al. July 31, 1 | 1990-07-31 |
Bolted circuit assembly with isolating washer
Grant 4,907,124 - Kaufman March 6, 1 | 1990-03-06 |
Hermetic direct bond circuit assembly
Grant 4,902,854 - Kaufman February 20, 1 | 1990-02-20 |
Heat sink apparatus with electrically insulative intermediate conduit portion for coolant flow
Grant 4,860,164 - Kaufman August 22, 1 | 1989-08-22 |
Direct bond circuit assembly with crimped lead frame
Grant 4,831,723 - Kaufman May 23, 1 | 1989-05-23 |
Direct current sense lead
Grant 4,818,895 - Kaufman April 4, 1 | 1989-04-04 |
Isolated package for multiple semiconductor power components
Grant 4,819,042 - Kaufman April 4, 1 | 1989-04-04 |
Method of making circuit assembly with hardened direct bond lead frame
Grant 4,788,765 - Kaufman , et al. December 6, 1 | 1988-12-06 |
Low cost compressively clamped circuit and heat sink assembly
Grant 4,724,514 - Kaufman February 9, 1 | 1988-02-09 |
Circuit assembly with semiconductor expansion matched thermal path
Grant 4,700,273 - Kaufman October 13, 1 | 1987-10-13 |
Circuit package with external circuit board and connection
Grant 4,630,174 - Kaufman * December 16, 1 | 1986-12-16 |
Method of mounting a compact circuit package to a heat sink or the like
Grant 4,577,387 - Kaufman March 25, 1 | 1986-03-25 |
Multiple substrate circuit package
Grant 4,554,613 - Kaufman November 19, 1 | 1985-11-19 |
Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
Grant 4,546,410 - Kaufman October 8, 1 | 1985-10-08 |
Mounting of a compact circuit package to a heat sink or the like
Grant 4,546,411 - Kaufman October 8, 1 | 1985-10-08 |
Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink
Grant 4,498,120 - Kaufman February 5, 1 | 1985-02-05 |
Lead frame connector for compact circuit package
Grant 4,488,202 - Kaufman December 11, 1 | 1984-12-11 |
Method of clamping a circuit package to enhance heat transfer
Grant 4,449,292 - Kaufman May 22, 1 | 1984-05-22 |
Compact circuit package having an improved lead frame connector
Grant 4,449,165 - Kaufman May 15, 1 | 1984-05-15 |
Power switching device having improved heat dissipation means
Grant 4,394,530 - Kaufman July 19, 1 | 1983-07-19 |
Positioning means for optically couplable circuit elements
Grant 4,266,140 - Kaufman May 5, 1 | 1981-05-05 |
Electrical power converter thyristor firing circuit having noise immunity
Grant 4,257,091 - Kaufman March 17, 1 | 1981-03-17 |
Variable resistance device for thick film circuitry
Grant 4,250,481 - Kaufman February 10, 1 | 1981-02-10 |
Compact circuit package having improved circuit connectors
Grant 4,218,724 - Kaufman August 19, 1 | 1980-08-19 |
Lead frame terminal
Grant 4,215,235 - Kaufman July 29, 1 | 1980-07-29 |
Dual resistor element
Grant 4,196,411 - Kaufman April 1, 1 | 1980-04-01 |
Photocoupling structure for a solid state power control device
Grant 4,156,148 - Kaufman May 22, 1 | 1979-05-22 |
High power thick film circuit with overlapping lead frame
Grant 3,958,075 - Kaufman May 18, 1 | 1976-05-18 |
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