Katsurayama; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Katsurayama; Satoru.The latest application filed is for "method for manufacturing electronic component, and electronic component".

Company Profile

0.16.17

Katsurayama; Satoru - Tokyo N/A JP
Katsurayama; Satoru - Utsunomiya JP
Katsurayama; Satoru - Utsunomiya City JP
Katsurayama; Satoru - Shinagawa-ku JP
Katsurayama; Satoru - Tochigi Prefecture JP
Katsurayama; Satoru - Tochigi JP
Katsurayama; Satoru - Shinagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 8,704,378 - Sugino , et al. April 22, 2	2014-04-22
Wafer dicing employing edge region underfill removal Grant 8,652,941 - Indyk , et al. February 18, 2	2014-02-18
Semiconductor electronic component and semiconductor device using the same Grant 8,629,564 - Katsurayama , et al. January 14, 2	2014-01-14
Method For Manufacturing Electronic Component, And Electronic Component App 20130324641 - MAEJIMA; Kenzou ; et al.	2013-12-05
Adhesive film Grant 8,597,785 - Komiyatani , et al. December 3, 2	2013-12-03
Method for manufacturing electronic component, and electronic component Grant 8,531,028 - Maejima , et al. September 10, 2	2013-09-10
Wafer Dicing Employing Edge Region Underfill Removal App 20130149841 - Indyk; Richard F. ; et al.	2013-06-13
Adhesive tape and semiconductor device using the same Grant 8,319,350 - Katsurayama , et al. November 27, 2	2012-11-27
Adhesive Film, Multilayer Circuit Board, Electronic Component And Semiconductor Device App 20120156502 - Maejima; Kenzou ; et al.	2012-06-21
Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same Grant 8,169,090 - Katsurayama , et al. May 1, 2	2012-05-01
Method For Manufacturing Electronic Component, And Electronic Component App 20120061820 - Maejima; Kenzou ; et al.	2012-03-15
Conductive Connecting Material, Method For Connecting Terminals Using The Conductive Connecting Material, And Method For Producing A Connecting Terminal App 20110311790 - Okada; Wataru ; et al.	2011-12-22
Flexible Substrate And Electronic Device App 20110262697 - Katsurayama; Satoru ; et al.	2011-10-27
Method for bonding semiconductor wafers and method for manufacturing semiconductor device Grant 8,039,305 - Mejima , et al. October 18, 2	2011-10-18
Pressurized underfill cure Grant 8,008,122 - Gaynes , et al. August 30, 2	2011-08-30
Method Of Manufacturing A Semiconductor Device And Semiconductor Device App 20110068483 - Katsurayama; Satoru	2011-03-24
Adhesive tape, connected structure and semiconductor package Grant 7,838,984 - Katsurayama , et al. November 23, 2	2010-11-23
Semiconductor device and method for manufacturing semiconductor device Grant 7,829,992 - Sugino , et al. November 9, 2	2010-11-09
Adhesive Tape App 20100203307 - Komiyatani; Toshio ; et al.	2010-08-12
Semiconductor Device App 20100181686 - Sugino; Mitsuo ; et al.	2010-07-22
Adhesive Tape, Semiconductor Package and Electronics App 20100155964 - Katsurayama; Satoru ; et al.	2010-06-24
Method For Bonding Semiconductor Wafers And Method For Manufacturing Semiconductor Device App 20100129960 - Mejima; Kenzou ; et al.	2010-05-27
Semiconductor Electronic Component And Semiconductor Device Using The Same App 20100102446 - Katsurayama; Satoru ; et al.	2010-04-29
Adhesive Tape And Semiconductor Device Using The Same App 20100078830 - Katsurayama; Satoru ; et al.	2010-04-01
Adhesive Tape, Connected Structure and Semiconductor Package App 20100059872 - Katsurayama; Satoru	2010-03-11
Semiconductor Device and Method for Manufacturing Semiconductor Device App 20090243065 - Sugino; Mitsuo ; et al.	2009-10-01
Encapsulating Resin Composition For Preapplication, Semiconductor Device Made With The Same, And Process For Producing The Same App 20090166897 - Katsurayama; Satoru ; et al.	2009-07-02

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