Katsura; Shinya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Katsura; Shinya.The latest application filed is for "electrically conductive material for connection component".

Company Profile

0.9.8

Katsura; Shinya - Shimonoseki JP
KATSURA; Shinya - Shimonoseki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically conductive material for connection component Grant 10,597,792 - Tsuru , et al.	2020-03-24
Copper alloy sheet strip with surface coating layer excellent in heat resistance Grant 10,233,517 - Tsuru , et al.	2019-03-19
Electrically Conductive Material For Connection Component App 20180371633 - TSURU; Masahiro ; et al.	2018-12-27
Copper alloy Grant 9,845,521 - Shishido , et al. December 19, 2	2017-12-19
Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance Grant 9,790,575 - Katsura October 17, 2	2017-10-17
Copper Alloy Sheet Strip With Surface Coating Layer Excellent In Heat Resistance App 20170058382 - TSURU; Masahiro ; et al.	2017-03-02
Copper alloy Grant 9,514,856 - Shishido , et al. December 6, 2	2016-12-06
Electric And Electronic Part Copper Alloy Sheet With Excellent Bending Workability And Stress Relaxation Resistance App 20160040270 - KATSURA; Shinya	2016-02-11
Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance Grant 9,194,026 - Katsura November 24, 2	2015-11-24
Copper Alloy App 20140193293 - Shishido; Hisao ; et al.	2014-07-10
Electric And Electronic Part Copper Alloy Sheet With Excellent Bending Workability And Stress Relaxation Resistance App 20130255838 - KATSURA; Shinya	2013-10-03
Copper Alloy App 20120148439 - SHISHIDO; Hisao ; et al.	2012-06-14
Copper alloy sheet and QFN package Grant 7,928,541 - Miwa , et al. April 19, 2	2011-04-19
Copper Alloy Sheet And Qfn Package App 20090224379 - MIWA; Yosuke ; et al.	2009-09-10

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