loadpatents
Patent applications and USPTO patent grants for Katsuki; Shozo.The latest application filed is for "emissivity measuring device".
Patent | Date |
---|---|
Process for preparing metal-coated aromatic polyimide film Grant 7,232,610 - Katsuki , et al. June 19, 2 | 2007-06-19 |
Small sized wide wave-range spectroscope Grant 7,193,707 - Ohnishi , et al. March 20, 2 | 2007-03-20 |
Wireless measuring device Grant 7,174,268 - Katsuki , et al. February 6, 2 | 2007-02-06 |
Emissivity measuring device App 20060067376 - Katsuki; Shozo ;   et al. | 2006-03-30 |
Wireless measuring device App 20060052987 - Katsuki; Shozo ;   et al. | 2006-03-09 |
Electro-conductive metal plated polyimide substrate Grant 6,979,497 - Katsuki , et al. December 27, 2 | 2005-12-27 |
Small sized wide wave-range spectroscope App 20050168738 - Ohnishi, Akira ;   et al. | 2005-08-04 |
Process for preparing metal-coated aromatic polyimide film App 20050118438 - Katsuki, Shozo ;   et al. | 2005-06-02 |
Copper-clad laminate App 20050019598 - Katsuki, Shozo ;   et al. | 2005-01-27 |
Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device Grant 6,838,184 - Takahashi , et al. January 4, 2 | 2005-01-04 |
Method of making a polyimide film having a thin metal layer Grant 6,824,827 - Katsuki , et al. November 30, 2 | 2004-11-30 |
Electro-conductive metal plated polyimide substrate App 20040110024 - Katsuki, Shozo ;   et al. | 2004-06-10 |
Surface treatment of polyimide film and polyimide film having a thin metal layer App 20040076765 - Katsuki, Shozo ;   et al. | 2004-04-22 |
Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device App 20030180557 - Takahashi, Takuji ;   et al. | 2003-09-25 |
Process for preparing metal-coated aromatic polyimide film App 20030049487 - Katsuki, Shozo ;   et al. | 2003-03-13 |
Process for preparing metal-coated aromatic polyimide film App 20030012927 - Katsuki, Shozo ;   et al. | 2003-01-16 |
Surface treatment of polyimide film and polyimide film having a thin metal layer App 20020177000 - Katsuki, Shozo ;   et al. | 2002-11-28 |
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