loadpatents
name:-0.0045170783996582
name:-0.0042569637298584
name:-0.00045585632324219
Katou; Yuuki Patent Filings

Katou; Yuuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Katou; Yuuki.The latest application filed is for "resin back door for vehicle and method of manufacturing the same".

Company Profile
0.4.8
  • Katou; Yuuki - Munakata JP
  • Katou; Yuuki - Munakata-shi JP
  • Katou; Yuuki - Otake JP
  • KATOU; Yuuki - Otake-shi JP
  • Katou; Yuuki - Ibaraki-shi JP
  • Katou; Yuuki - Osaka JP
  • Katou; Yuuki - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin back door for vehicle and method of manufacturing the same
Grant 10,723,209 - Chiba , et al.
2020-07-28
Resin Back Door For Vehicle And Method Of Manufacturing The Same
App 20190184798 - CHIBA; Kenji ;   et al.
2019-06-20
Method for producing saturated aldehyde from 1,2-alkanediol
Grant 9,393,554 - Sugiyama , et al. July 19, 2
2016-07-19
Method For Producing Saturated Aldehyde From 1,2-alkanediol
App 20150343429 - SUGIYAMA; Shigeru ;   et al.
2015-12-03
Adhesive Sheet
App 20140050874 - Takeda; Kohei ;   et al.
2014-02-20
Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheet
Grant 8,226,398 - Ooyama , et al. July 24, 2
2012-07-24
Apparatus and Method for Inflation Extrusion Molding of Pressure-Sensitive Adhesive Sheet
App 20120112380 - OOYAMA; Kooki ;   et al.
2012-05-10
Pressure-sensitive Adhesive Tape
App 20120070658 - IKISHIMA; Shinsuke ;   et al.
2012-03-22
Pressure-sensitive Adhesive Tape
App 20120070661 - IKISHIMA; Shinsuke ;   et al.
2012-03-22
Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheet
Grant 8,092,204 - Ooyama , et al. January 10, 2
2012-01-10
Apparatus And Method For Inflation Extrusion Molding Of Pressure-sensitive Adhesive Sheet
App 20110233827 - OOYAMA; Kooki ;   et al.
2011-09-29

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