KATO; Hirotaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for KATO; Hirotaka.The latest application filed is for "fixing structure of wiring member and wiring member".
- KATO; Hirotaka - Mie JP
- Kato; Hirotaka - Nukata-gun JP
- KATO; Hirotaka - Nagasaki JP
- KATO; Hirotaka - Shiga JP
- Kato; Hirotaka - Aichi-ken JP
- Kato; Hirotaka - Kanagawa JP
- Kato; Hirotaka - Tokyo JP
- KATO, HIROTAKA - OBU-SHI JP
- Kato; Hirotaka - Osaka JP
- Kato; Hirotaka - Hiratsuka JP
| Patent | Date |
|---|---|
| Fixing Structure Of Wiring Member And Wiring Member App 20220294198 - KATO; Hirotaka ; et al. | 2022-09-15 |
| Wire Harness Routing Device App 20220219628 - KATO; Hirotaka ; et al. | 2022-07-14 |
| Wiring Harness Unit And Wiring Harness Mounting Structure App 20220169190 - KATO; Hirotaka ; et al. | 2022-06-02 |
| Wire Harness And Wire Harness Routing Apparatus App 20220134975 - YAMAMOTO; Satoshi ; et al. | 2022-05-05 |
| Travel Controller And Method For Travel Control App 20220063721 - Kashu; Takao ; et al. | 2022-03-03 |
| Travel Controller And Method For Travel Control App 20220063657 - KASHU; Takao ; et al. | 2022-03-03 |
| Route Selection Device And Method App 20210403028 - KASHU; Takao ; et al. | 2021-12-30 |
| Semiconductor Wafer Evaluation Method And Semiconductor Wafer Manufacturing Method App 20200411391 - NAGASAWA; Takahiro ; et al. | 2020-12-31 |
| Tongue App 20200359750 - INISHI; Hodaka ; et al. | 2020-11-19 |
| Vehicle seat Grant 10,220,739 - Okuhara , et al. | 2019-03-05 |
| Vehicle seat Grant 9,981,581 - Okuhara , et al. May 29, 2 | 2018-05-29 |
| Vehicle Seat App 20180118065 - OKUHARA; Yoshikatsu ; et al. | 2018-05-03 |
| Vehicle Seat App 20180111528 - OKUHARA; Yoshikatsu ; et al. | 2018-04-26 |
| Method of manufacturing epitaxial silicon wafer and apparatus therefor Grant 8,888,913 - Narahara , et al. November 18, 2 | 2014-11-18 |
| Method Of Manufacturing Epitaxial Silicon Wafer And Apparatus Therefor App 20120015454 - Narahara; Kazuhiro ; et al. | 2012-01-19 |
| Method of manufacturing epitaxial silicon wafer and apparatus therefor Grant 8,021,484 - Narahara , et al. September 20, 2 | 2011-09-20 |
| Method of manufacturing epitaxial silicon wafer Grant 7,993,452 - Hayashida , et al. August 9, 2 | 2011-08-09 |
| Method of manufacturing epitaxial silicon wafer App 20070228524 - Hayashida; Koichiro ; et al. | 2007-10-04 |
| Method of manufacturing epitaxial silicon wafer and apparatus thereof App 20070227441 - Narahara; Kazuhiro ; et al. | 2007-10-04 |
| Book binding kit App 20060120828 - Kato; Hirotaka | 2006-06-08 |
| Commutateur Of Improved Segment Joinability App 20010013737 - FUJII, SHINICHI ; et al. | 2001-08-16 |
| Sinter joining method and sintered composite member produced by same Grant 5,948,549 - Takayama , et al. September 7, 1 | 1999-09-07 |
| Method of fabricating direct-bonded semiconductor wafers Grant 5,932,048 - Furukawa , et al. August 3, 1 | 1999-08-03 |
| Jig for peeling a bonded wafer Grant 5,897,743 - Fujimoto , et al. April 27, 1 | 1999-04-27 |
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