| Patent | Date |
|---|
Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process
Grant 11,294,282 - Hayashi , et al. April 5, 2 | 2022-04-05 |
Photosensitive resin composition, photosensitive dry film, and pattern forming process
Grant 11,262,655 - Maruyama , et al. March 1, 2 | 2022-03-01 |
Wafer processing laminate and method for processing wafer
Grant 10,991,611 - Tagami , et al. April 27, 2 | 2021-04-27 |
Polymer containing silphenylene and polyether structures
Grant 10,982,053 - Maruyama , et al. April 20, 2 | 2021-04-20 |
Laminate and pattern forming method
Grant 10,948,823 - Asai , et al. March 16, 2 | 2021-03-16 |
Wafer laminate, method for production thereof, and adhesive composition for wafer laminate
Grant 10,658,314 - Yasuda , et al. | 2020-05-19 |
Wafer laminate and method of producing the same
Grant 10,553,552 - Yasuda , et al. Fe | 2020-02-04 |
Polymer Containing Silphenylene And Polyether Structures
App 20190352465 - Maruyama; Hitoshi ; et al. | 2019-11-21 |
Photosensitive Resin Composition, Photosensitive Dry Film, And Pattern Forming Process
App 20190354014 - Maruyama; Hitoshi ; et al. | 2019-11-21 |
Wafer laminate and making method
Grant 10,453,732 - Yasuda , et al. Oc | 2019-10-22 |
Film material and pattern forming process
Grant 10,416,559 - Asai , et al. Sept | 2019-09-17 |
Laminate and making method
Grant 10,373,903 - Yasuda , et al. | 2019-08-06 |
Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same
Grant 10,319,653 - Takemura , et al. | 2019-06-11 |
Semiconductor device, making method, and laminate
Grant 10,297,485 - Yasuda , et al. | 2019-05-21 |
Epoxy-containing, Isocyanurate-modified Silicone Resin, Photosensitive Resin Composition, Photosensitive Dry Film, Laminate, And Pattern Forming Process
App 20190064666 - Hayashi; Kumiko ; et al. | 2019-02-28 |
Wafer Processing Laminate And Method For Processing Wafer
App 20190027391 - TAGAMI; Shohei ; et al. | 2019-01-24 |
Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
Grant 10,141,272 - Takemura , et al. Nov | 2018-11-27 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 10,128,143 - Tanabe , et al. November 13, 2 | 2018-11-13 |
Wafer processing laminate and method for processing wafer
Grant 10,115,622 - Tagami , et al. October 30, 2 | 2018-10-30 |
Laminate And Making Method
App 20180277472 - Yasuda; Hiroyuki ; et al. | 2018-09-27 |
Semiconductor Device, Making Method, And Laminate
App 20180277415 - Yasuda; Hiroyuki ; et al. | 2018-09-27 |
Resin composition, resin film, semiconductor device and method of manufacture thereof
Grant 10,026,650 - Kondo , et al. July 17, 2 | 2018-07-17 |
Photo-curable resin composition and photo-curable dry film using the same
Grant 9,971,242 - Asai , et al. May 15, 2 | 2018-05-15 |
Film Material And Pattern Forming Process
App 20180107115 - Asai; Satoshi ; et al. | 2018-04-19 |
Laminate And Pattern Forming Method
App 20180107116 - Asai; Satoshi ; et al. | 2018-04-19 |
Wafer Laminate, Method For Production Thereof, And Adhesive Composition For Wafer Laminate
App 20180102333 - Yasuda; Hiroyuki ; et al. | 2018-04-12 |
Wafer Laminate And Method Of Producing The Same
App 20180102334 - Yasuda; Hiroyuki ; et al. | 2018-04-12 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 9,887,118 - Tagami , et al. February 6, 2 | 2018-02-06 |
Wafer Processing Laminate And Method For Processing Wafer
App 20170154801 - TAGAMI; Shohei ; et al. | 2017-06-01 |
Wafer Laminate And Making Method
App 20170154802 - Yasuda; Hiroyuki ; et al. | 2017-06-01 |
Method for manufacturing micro-structure
Grant 9,650,538 - Kato , et al. May 16, 2 | 2017-05-16 |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
Grant 9,653,335 - Kato , et al. May 16, 2 | 2017-05-16 |
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same
App 20170103932 - TAKEMURA; Katsuya ; et al. | 2017-04-13 |
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same
App 20170077043 - TAKEMURA; Katsuya ; et al. | 2017-03-16 |
Photo-curable Resin Composition And Photo-curable Dry Film Using The Same
App 20160357105 - ASAI; Satoshi ; et al. | 2016-12-08 |
Resin Composition, Resin Film, Semiconductor Device And Method Of Manufacture Thereof
App 20160315025 - Kondo; Kazunori ; et al. | 2016-10-27 |
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
Grant 9,472,438 - Kondo , et al. October 18, 2 | 2016-10-18 |
Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same
Grant 9,458,365 - Kim , et al. October 4, 2 | 2016-10-04 |
Silicone resin, resin composition, resin film, semiconductor device, and making method
Grant 9,447,305 - Kondo , et al. September 20, 2 | 2016-09-20 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20160189996 - TANABE; Masahito ; et al. | 2016-06-30 |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
Grant 9,365,681 - Kato , et al. June 14, 2 | 2016-06-14 |
Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer
Grant 9,334,424 - Tanabe , et al. May 10, 2 | 2016-05-10 |
Silicone Resin, Resin Composition, Resin Film, Semiconductor Device, And Making Method
App 20160122586 - KONDO; Kazunori ; et al. | 2016-05-05 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20160093522 - TAGAMI; Shohei ; et al. | 2016-03-31 |
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
Grant 9,263,333 - Sugo , et al. February 16, 2 | 2016-02-16 |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
Grant 9,096,032 - Kato , et al. August 4, 2 | 2015-08-04 |
Photo-curable resin composition, photo-curable dry film, patterning process, protective film, and electric/electronic part
Grant 9,012,111 - Asai , et al. April 21, 2 | 2015-04-21 |
Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
Grant 8,999,817 - Tagami , et al. April 7, 2 | 2015-04-07 |
Temporary Bonding Adhesive Compositions And Methods Of Manufacturing A Semiconductor Device Using The Same
App 20150024574 - Kim; Tae-Hoon ; et al. | 2015-01-22 |
Method For Manufacturing Micro-structure
App 20140296380 - KATO; Hideto ; et al. | 2014-10-02 |
Temporary Adhesive Composition, And Method Of Producing Thin Wafer
App 20140261978 - Furuya; Masahiro ; et al. | 2014-09-18 |
Temporary adhesive composition, and method of producing thin wafer
Grant 8,785,585 - Furuya , et al. July 22, 2 | 2014-07-22 |
Method for manufacturing micro-structure
Grant 8,785,114 - Kato , et al. July 22, 2 | 2014-07-22 |
Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
Grant 8,748,293 - Furuya , et al. June 10, 2 | 2014-06-10 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Adhering Material For Processing Wafer, And Manufacturing Method Of Thin Wafer
App 20140154868 - SUGO; Michihiro ; et al. | 2014-06-05 |
Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts
Grant 8,729,148 - Asai , et al. May 20, 2 | 2014-05-20 |
Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method
Grant 8,715,905 - Tagami , et al. May 6, 2 | 2014-05-06 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Adhering Material For Processing Wafer, And Manufacturing Method Of Thin Wafer
App 20140106137 - KONDO; Kazunori ; et al. | 2014-04-17 |
Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective film
Grant 8,697,333 - Soga , et al. April 15, 2 | 2014-04-15 |
Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition
Grant 8,673,537 - Furuya , et al. March 18, 2 | 2014-03-18 |
Silphenylene-containing Photocurable Composition, Pattern Formation Method Using Same, And Optical Semiconductor Element Obtained Using The Method
App 20140011126 - Tagami; Shohei ; et al. | 2014-01-09 |
Photo-curable Resin Composition, Photo-curable Dry Film, Patterning Process, Protective Film, And Electric/electronic Part
App 20130323631 - ASAI; Satoshi ; et al. | 2013-12-05 |
Temporary Adhesive For Wafer Processing, Member For Wafer Processing Using The Same, Wafer Processed Body, And Method For Producing Thin Wafer
App 20130302983 - TANABE; Masahito ; et al. | 2013-11-14 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Bonding Arrangement, And Thin Wafer Manufacturing Method
App 20130280886 - Kato; Hideto ; et al. | 2013-10-24 |
Wafer Process Body, Wafer Processing Member, Wafer Processing Temporary Adhesive Material, And Method For Manufacturing Thin Wafer
App 20130220687 - TAGAMI; Shohei ; et al. | 2013-08-29 |
Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
Grant 8,501,879 - Kondo , et al. August 6, 2 | 2013-08-06 |
Polyimidesilicone having alcoholic hydroxyl group and process for producing the same
Grant 8,487,062 - Sugo , et al. July 16, 2 | 2013-07-16 |
Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film
Grant 8,481,244 - Takeda , et al. July 9, 2 | 2013-07-09 |
Silphenylene skeleton-containing silicone type polymer and method for manufacturing the same
Grant 8,476,379 - Yasuda , et al. July 2, 2 | 2013-07-02 |
Method for manufacturing lamination type semiconductor integrated device
Grant 8,466,041 - Kuroda , et al. June 18, 2 | 2013-06-18 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Bonding Arrangement, And Thin Wafer Manufacturing Method
App 20130108866 - Kato; Hideto ; et al. | 2013-05-02 |
Alcoholic hydroxyl-containing compounds and making method
Grant 8,378,148 - Sakurai , et al. February 19, 2 | 2013-02-19 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Bonding Arrangement, And Thin Wafer Manufacturing Method
App 20130029145 - Kato; Hideto ; et al. | 2013-01-31 |
Organopolysiloxane, Temporary Adhesive Composition Containing Organopolysiloxane, And Method Of Producing Thinned Wafer Using The Same
App 20120276717 - FURUYA; Masahiro ; et al. | 2012-11-01 |
Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation
Grant 8,263,308 - Tagami , et al. September 11, 2 | 2012-09-11 |
Temporary Adhesive Composition, And Method Of Producing Thin Wafer
App 20120175045 - Furuya; Masahiro ; et al. | 2012-07-12 |
Wafer Mold Material And Method For Manufacturing Semiconductor Apparatus
App 20120139131 - SUGO; Michihiro ; et al. | 2012-06-07 |
Adhesive Composition, Adhesive Sheet, Semiconductor Apparatus Protection Material, And Semiconductor Apparatus
App 20120108762 - KONDO; Kazunori ; et al. | 2012-05-03 |
Photocurable Resin Composition, Dry Film Thereof, Pattern Forming Method, And Electrical/electronic Part Protective Film
App 20120094222 - SOGA; Kyoko ; et al. | 2012-04-19 |
Silphenylene-containing Photocurable Composition, Pattern Formation Method Using Same, And Optical Semiconductor Element Obtained Using The Method
App 20110311788 - TAGAMI; Shohei ; et al. | 2011-12-22 |
Method For Manufacturing Micro-structure
App 20110305990 - KATO; Hideto ; et al. | 2011-12-15 |
Novel Silphenylene Skeleton-containing Silicone Type Polymer And Method For Manufacturing The Same
App 20110275768 - YASUDA; Hiroyuki ; et al. | 2011-11-10 |
Polyorganosiloxane, resin composition, and patterning process
Grant 8,048,611 - Kato , et al. November 1, 2 | 2011-11-01 |
Photocurable Dry Film, Method For Preparing Same, Patterning Method And Film For Protecting Electric And Electronic Parts
App 20110143092 - ASAI; Satoshi ; et al. | 2011-06-16 |
Photo-curable Resin Composition, Pattern Forming Method And Substrate Protecting Film, And Film-shaped Adhesive And Adhesive Sheet Using Said Composition
App 20110143103 - Furuya; Masahiro ; et al. | 2011-06-16 |
Method For Manufacturing Lamination Type Semiconductor Integrated Device
App 20110136321 - KURODA; Yasuyoshi ; et al. | 2011-06-09 |
Alcoholic Hydroxyl-containing Compounds And Making Method
App 20110082321 - SAKURAI; Takato ; et al. | 2011-04-07 |
Epoxy-containing Polymer, Photo-curable Resin Composition, Patterning Process, And Electric/electronic Part Protective Film
App 20110076465 - Takeda; Takanobu ; et al. | 2011-03-31 |
Novel Polyimidesilicone Having Alcoholic Hydroxyl Group And Process For Producing The Same
App 20110077374 - SUGO; Michihiro ; et al. | 2011-03-31 |
Novel Polyimide Silicone, Photosensitive Resin Composition Containing The Novel Polyimide Silicone, And Method For Pattern Formation
App 20100233619 - TAGAMI; Shohei ; et al. | 2010-09-16 |
Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film
Grant 7,785,766 - Kato , et al. August 31, 2 | 2010-08-31 |
Polyimide silicone resin and thermosetting composition comprising the same
Grant 7,781,541 - Sugo , et al. August 24, 2 | 2010-08-24 |
Polyimide having an alcoholic hydroxyl group and a process for the preparation thereof
Grant 7,678,874 - Sugo , et al. March 16, 2 | 2010-03-16 |
Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
Grant 7,638,259 - Goto , et al. December 29, 2 | 2009-12-29 |
Polyorganosiloxane, Resin Composition, And Patterning Process
App 20090269697 - KATO; Hideto ; et al. | 2009-10-29 |
Polyimide Having An Alcoholic Hydroxyl Group And A Process For The Preparation Thereof
App 20090131620 - SUGO; Michihiro ; et al. | 2009-05-21 |
Camera integral with optical fiber
Grant 7,522,796 - Uchida , et al. April 21, 2 | 2009-04-21 |
Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
Grant 7,485,405 - Kato , et al. February 3, 2 | 2009-02-03 |
Resist lower layer film material and method for forming a pattern
Grant 7,476,485 - Hatakeyama , et al. January 13, 2 | 2009-01-13 |
Camera Integral With Optical Fiber
App 20080253724 - Uchida; Tamotsu ; et al. | 2008-10-16 |
Silphenylene-bearing Polymer, Photo-curable Resin Composition, Patterning Process, And Substrate Circuit Protective Film
App 20080182087 - KATO; Hideto ; et al. | 2008-07-31 |
Positive photoresist composition
Grant 7,378,215 - Yamaguchi , et al. May 27, 2 | 2008-05-27 |
Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
App 20080057446 - Goto; Tomoyuki ; et al. | 2008-03-06 |
Polyimide silicone resin and thermosetting composition comprising the same
App 20070197680 - Sugo; Michihiro ; et al. | 2007-08-23 |
Positive photoresist composition
App 20070134591 - Yamaguchi; Hiromasa ; et al. | 2007-06-14 |
Resist lower layer film material and method for forming a pattern
Grant 7,214,743 - Hatakeyama , et al. May 8, 2 | 2007-05-08 |
Positive resist composition and patterning process
Grant 7,175,960 - Furihata , et al. February 13, 2 | 2007-02-13 |
Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film
Grant 7,132,220 - Arai , et al. November 7, 2 | 2006-11-07 |
Photosensitive resin and a method of preparing the same
App 20060183880 - Aoki; Yoshitaka ; et al. | 2006-08-17 |
Epoxy resin compositions
Grant 7,060,761 - Arai , et al. June 13, 2 | 2006-06-13 |
Colorless and transparent polyimidesilicone resin having thermosetting functional groups
Grant 7,041,766 - Yoneda , et al. May 9, 2 | 2006-05-09 |
Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
App 20060079658 - Kato; Hideto ; et al. | 2006-04-13 |
Polyimide having an alcoholic hydroxyl group and a process for the preparation thereof
App 20060069227 - Sugo; Michihiro ; et al. | 2006-03-30 |
Positive resist composition and patterning process
Grant 6,911,292 - Furihata , et al. June 28, 2 | 2005-06-28 |
Photo-curable resin composition, patterning process, and substrate protecting film
Grant 6,899,991 - Kato , et al. May 31, 2 | 2005-05-31 |
Positive resist composition and patterning process
App 20050058937 - Furihata, Tomoyoshi ; et al. | 2005-03-17 |
Resist composition and patterning process
Grant 6,866,982 - Kato , et al. March 15, 2 | 2005-03-15 |
Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate-protecting coat
Grant 6,867,325 - Kato , et al. March 15, 2 | 2005-03-15 |
Resist lower layer film material and method for forming a pattern
App 20040259037 - Hatakeyama, Jun ; et al. | 2004-12-23 |
Resist lower layer film material and method for forming a pattern
App 20040241577 - Hatakeyama, Jun ; et al. | 2004-12-02 |
Hybrid compound, resist, and patterning process
Grant 6,790,581 - Kato , et al. September 14, 2 | 2004-09-14 |
Positive photoresist composition
Grant 6,773,858 - Kato , et al. August 10, 2 | 2004-08-10 |
Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film
App 20040142276 - Arai, Kazuhiro ; et al. | 2004-07-22 |
Positive resist composition and patterning process
App 20040131964 - Furihata, Tomoyoshi ; et al. | 2004-07-08 |
Electrode-forming compositions and electrode members
Grant 6,723,432 - Sugo , et al. April 20, 2 | 2004-04-20 |
Colorless and transparent polyimidesilicone resin having thermosetting functional groups
App 20040072982 - Yoneda, Yoshinori ; et al. | 2004-04-15 |
Solventless polyimide silicone resin compositions
Grant 6,706,841 - Sugo , et al. March 16, 2 | 2004-03-16 |
Polyimide silicone resin, its solution composition, and polyimide silicone resin film
Grant 6,703,133 - Sugo , et al. March 9, 2 | 2004-03-09 |
Epoxy resin compositions
App 20040034187 - Arai, Kazuhiro ; et al. | 2004-02-19 |
Positive photoresist composition
App 20040029032 - Kato, Hideto ; et al. | 2004-02-12 |
Resist composition and patterning process
Grant 6,635,400 - Kato , et al. October 21, 2 | 2003-10-21 |
Resist composition and patterning process
App 20030175617 - Kato, Hideto ; et al. | 2003-09-18 |
Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating
Grant 6,590,010 - Kato , et al. July 8, 2 | 2003-07-08 |
Photo-curable resin composition, patterning process, and substrate protecting film
App 20030113662 - Kato, Hideto ; et al. | 2003-06-19 |
Hybrid compound, resist, and patterning process
App 20030096191 - Kato, Hideto ; et al. | 2003-05-22 |
Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate-protecting coat
App 20030064168 - Kato, Hideto ; et al. | 2003-04-03 |
Polyimide silicone resin, process for its production, and polyimide silicone resin composition
Grant 6,538,093 - Sugo , et al. March 25, 2 | 2003-03-25 |
Electrode-forming compositions and electrode members
App 20030040578 - Sugo, Michihiro ; et al. | 2003-02-27 |
Solventless polyimide silicone resin compositions
App 20020188069 - Sugo, Michihiro ; et al. | 2002-12-12 |
Positive resist composition suitable for lift-off technique and pattern forming method
Grant 6,440,646 - Ueda , et al. August 27, 2 | 2002-08-27 |
Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating
App 20020055550 - Kato, Hideto ; et al. | 2002-05-09 |
Micropatterning method
Grant 6,383,944 - Furihata , et al. May 7, 2 | 2002-05-07 |
Electrostatic capacity sensor
App 20020024344 - Kato, Ryochi ; et al. | 2002-02-28 |
Polyimide silicone resin, its solution composition, and polyimide silicone resin film
App 20020016408 - Sugo, Michihiro ; et al. | 2002-02-07 |
Polyimide silicone resin, process for its production, and polyimide silicone resin composition
App 20020016438 - Sugo, Michihiro ; et al. | 2002-02-07 |
Resist composition and patterning process
App 20010044066 - Kato, Hideto ; et al. | 2001-11-22 |
Heat-curable photosensitive compositions
App 20010038965 - Ueda, Takafumi ; et al. | 2001-11-08 |
Lift-off resist compositions
App 20010019808 - Noda, Kazumi ; et al. | 2001-09-06 |
Novel polymers and positive resist compositions
App 20010018497 - Furihata, Tomoyoshi ; et al. | 2001-08-30 |
Positive resist composition suitable for lift-off technique and pattern forming method
App 20010018160 - Ueda, Takafumi ; et al. | 2001-08-30 |
Surface treatment agent for resist pattern, and patterning process
App 20010012601 - Fujii, Toshihiko ; et al. | 2001-08-09 |
Polymers and positive resist compositions
Grant 6,221,989 - Furihata , et al. April 24, 2 | 2001-04-24 |
Positive resist composition suitable for lift-off technique and pattern forming method
Grant 6,210,855 - Ueda , et al. April 3, 2 | 2001-04-03 |
Photosensitive resin composition
Grant 6,001,534 - Kato December 14, 1 | 1999-12-14 |
Polyimide resin composition
Grant 5,714,572 - Kato February 3, 1 | 1998-02-03 |
Photosensitive resin composition and a process for forming a patterned polyimide film using the same
Grant 5,587,275 - Kato December 24, 1 | 1996-12-24 |
Ocular lens material
Grant 5,543,442 - Hiratani , et al. August 6, 1 | 1996-08-06 |
Photosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinone
Grant 5,441,845 - Okinoshima , et al. August 15, 1 | 1995-08-15 |
Photosensitive polymer composition
Grant 5,292,619 - Okinoshima , et al. March 8, 1 | 1994-03-08 |
Curable resin compositions and electronic part protective coatings
Grant 5,272,222 - Okinoshima , et al. * December 21, 1 | 1993-12-21 |
Polyimide resin solution compositions
Grant 5,089,549 - Kato February 18, 1 | 1992-02-18 |
Methacrylic acid ester
Grant 4,742,177 - Yamamoto , et al. May 3, 1 | 1988-05-03 |
Novel organosilicon compound
Grant 4,652,663 - Takago , et al. March 24, 1 | 1987-03-24 |
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