Katayama; Youji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Katayama; Youji.The latest application filed is for "method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film".

Company Profile

0.5.5

Katayama; Youji - Hitachi JP
Katayama; Youji - Hitachi-shi JP
Katayama; Youji - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat-resistant resin paste Grant 8,759,440 - Kawakami , et al. June 24, 2	2014-06-24
Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them Grant 8,404,564 - Nakamura , et al. March 26, 2	2013-03-26
Method For Manufacturing Semiconductor Chip, Adhesive Film For Semiconductor, And Composite Sheet Using The Film App 20120244347 - Nakamura; Yuuki ; et al.	2012-09-27
Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film Grant 8,232,185 - Nakamura , et al. July 31, 2	2012-07-31
Double-faced Adhesive Film And Electronic Component Module Using Same App 20110210407 - Katayama; Youji ; et al.	2011-09-01
Method For Manufacturing Semiconductor Chip, Adhesive Film For Semiconductor, And Composite Sheet Using The Film App 20100120229 - Nakamura; Yuuki ; et al.	2010-05-13
Adhesive Film For Semiconductor, Composite Sheet, And Method For Producing Semiconductor Chip Using Them App 20100112783 - Nakamura; Yuuki ; et al.	2010-05-06
Heat-resistant Resin Paste App 20090264582 - Kawakami; Hiroyuki ; et al.	2009-10-22

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