KATAOKA; Tatsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for KATAOKA; Tatsuo.The latest application filed is for "flexible printed wiring board and semiconductor device employing the same".

Company Profile

0.11.17

KATAOKA; Tatsuo - Ageo-shi JP
Kataoka; Tatsuo - Saitama JP
Kataoka; Tatsuo - Ageo JP
Kataoka; Tatsuo - Tokyo JP
Kataoka; Tatsuo - Shizuoka JP
Kataoka; Tatsuo - Kawaguchi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible Printed Wiring Board And Semiconductor Device Employing The Same App 20100244281 - HAYASHI; Katsuhiko ; et al.	2010-09-30
Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board App 20090317591 - Sato; Tetsuro ; et al.	2009-12-24
Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation App 20090314525 - Kajino; Hitoshi ; et al.	2009-12-24
Wiring Boards and Processes for Manufacturing the Same App 20090183901 - Kataoka; Tatsuo ; et al.	2009-07-23
Method for producing a printed circuit board Grant 7,523,548 - Kataoka , et al. April 28, 2	2009-04-28
Printed wiring board, its manufacturing method, and circuit device Grant 7,495,177 - Kataoka , et al. February 24, 2	2009-02-24
Printed Wiring Board, Process for Producing the Same and Usage of the Same App 20090044971 - Kataoka; Tatsuo ; et al.	2009-02-19
Printed Wiring Board, Process For Producing the Same and Semiconductor Device App 20080236872 - Kataoka; Tatsuo ; et al.	2008-10-02
Printed wiring board, method for manufacturing same, and circuit device App 20070145584 - Kataoka; Tatsuo ; et al.	2007-06-28
Printed wiring board, its manufacturing method, and circuit device App 20070111401 - Kataoka; Tatsuo ; et al.	2007-05-17
Printed wiring board, its manufacturing method and circuit device App 20070101571 - Kataoka; Tatsuo ; et al.	2007-05-10
Substrate cleaning system and substrate cleaning method App 20070006904 - Hagiwara; Takehiro ; et al.	2007-01-11
Film carrier tape for mounting electronic devices thereon Grant 7,060,364 - Kataoka , et al. June 13, 2	2006-06-13
Film carrier tape for mounting of electronic part App 20060027912 - Kataoka; Tatsuo ; et al.	2006-02-09
Substrate treatment apparatus Grant 6,955,178 - Kuzumoto , et al. October 18, 2	2005-10-18
Film carrier tape for mounting electronic devices thereon and production method thereof App 20040219341 - Kataoka, Tatsuo ; et al.	2004-11-04
Plating-pretreatment solution and plating-pretreatment method App 20040202958 - Kataoka, Tatsuo ; et al.	2004-10-14
2-Metal layer TAB tape and both-sided CSP.cndot.BGA tape Grant 6,798,048 - Ichiryu , et al. September 28, 2	2004-09-28
Apparatus for removing photoresist film Grant 6,715,944 - Oya , et al. April 6, 2	2004-04-06
Printed circuit board and production method therefor, and laminated printed circuit board App 20040026122 - Hayashi, Katsuhiko ; et al.	2004-02-12
Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing method App 20030226687 - Kataoka, Tatsuo ; et al.	2003-12-11
Substrate treatment method Grant 6,616,773 - Kuzumoto , et al. September 9, 2	2003-09-09
Method of removing photoresist film Grant 6,517,999 - Oya , et al. February 11, 2	2003-02-11
Two-metal tab tape, double-sided csp tape, bga tape and method for manufacturing the same App 20020187334 - Ichiryu, Akira ; et al.	2002-12-12
Apparatus for removing photoresist film App 20020115024 - Oya, Izumi ; et al.	2002-08-22
Tape carrier having connection function Grant 5,173,369 - Kataoka December 22, 1	1992-12-22
Printed circuit board having bumps and method of forming bumps Grant 5,118,386 - Kataoka , et al. June 2, 1	1992-06-02
Mounting substrate and its production method, and printed wiring board having connector function and its connection method Grant 5,019,944 - Ishii , et al. May 28, 1	1991-05-28

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